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UCC5672PWPR/1G4

Texas Instruments

UCC5672PWPR/1G4 by Texas Instruments

UCC5672PWPR/1G4 by Texas Instruments is a SCSI bus terminator with 28 terminals, operating at 3.3V nominal voltage and supporting differential output. It features a small outline package style, dual terminal position, and BICMOS technology. Ideal for data bus termination applications in commercial-grade environments with temperatures ranging from 0 to 70°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,123 parts In-Stock

1+ parts

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3,123

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Digiode

USA . 3,115 parts In-Stock

1+ parts

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3,115

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Nova Conductors

Japan . 22 parts In-Stock

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22

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 396 parts In-Stock

1+ parts

$2.562

100+ parts

-

1k+ parts

$3.051

10k+ parts

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396

$2.562

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$3.051

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DigiPath Technology Company

USA . 1,966 parts In-Stock

1+ parts

$2.821

100+ parts

$2.596

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1,966

$2.821

$2.596

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ChromeModa Solutions

Germany . 4,591 parts In-Stock

1+ parts

$2.879

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$2.361

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4,591

$2.879

$2.361

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IDEA Electronic Components Group

UK . 2,010 parts In-Stock

1+ parts

$2.879

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$2.591

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2,010

$2.879

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$2.591

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AZTECH Wire

Italy . 361 parts In-Stock

1+ parts

$5.959

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361

$5.959

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One Stop Electronics

USA . 566 parts In-Stock

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$13.500

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566

$13.500

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Ampacity Inc.

Singapore . 248 parts In-Stock

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$26.500

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248

$26.500

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Corphita

USA . 2,315 parts In-Stock

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2,315

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Aranea Global

USA . 2,000 parts In-Stock

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2,000

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Overview

Unlock the power of seamless data transmission with the UCC5672PWPR/1G4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability. This data bus terminator is designed to optimize performance and enhance connectivity in a variety of applications. With its small outline package and dual terminal position, this product offers unmatched value and efficiency. Experience the benefits of superior technology and innovation with the UCC5672PWPR/1G4 for all your interface IC needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material provides durability and flexibility in design.

Surface Mount: YES

Allows for easy installation on printed circuit boards.

Maximum Supply Voltage: 5.25 V

Can handle high voltage inputs, suitable for various applications.

Package Shape: RECTANGULAR

Compact shape for efficient use of board space.

Power Supplies (V): 3/5

Supports multiple power supply options for flexibility in usage.

No. of Terminals: 28

Provides ample terminals for connectivity.

Terminal Position: DUAL

Dual terminal position for enhanced stability and connectivity.

Nominal Pull Up Resistance: 105 ohm

Provides appropriate resistance for signal integrity.

Interface IC Type: SCSI BUS TERMINATOR

Specifically designed for SCSI bus termination, ensuring compatibility.

Technical Specifications

Data Bus Terminators UCC5672PWPR/1G4 attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

YES

Interface IC Type:

JESD-30 Code:

R-PDSO-G28

Length:

9.7 mm

No. of Functions:

1

No. of Signal Lines:

9

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5

Nominal Pull Up Resistance:

105 ohm

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

UCC5672PWPR/1G4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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