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UCC5680PW28G4

Texas Instruments

UCC5680PW28G4 by Texas Instruments

UCC5680PW28G4 by Texas Instruments is a SCSI bus terminator with 28 terminals and a supply voltage range of 2.7V to 5.25V. It features a small outline package style, differential output, and nickel palladium gold terminal finish. Ideal for commercial applications requiring precise data bus termination in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,330 parts In-Stock

1+ parts

-

100+ parts

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7,330

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Digiode

USA . 3,802 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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3,802

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,317 parts In-Stock

1+ parts

$5.981

100+ parts

-

1k+ parts

$6.757

10k+ parts

-

2,317

$5.981

-

$6.757

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DigiPath Technology Company

USA . 847 parts In-Stock

1+ parts

$6.586

100+ parts

$6.059

1k+ parts

-

10k+ parts

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847

$6.586

$6.059

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IDEA Electronic Components Group

UK . 1,973 parts In-Stock

1+ parts

$6.720

100+ parts

-

1k+ parts

$6.048

10k+ parts

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1,973

$6.720

-

$6.048

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ChromeModa Solutions

Germany . 93 parts In-Stock

1+ parts

$6.720

100+ parts

$5.510

1k+ parts

-

10k+ parts

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93

$6.720

$5.510

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AZTECH Wire

Italy . 851 parts In-Stock

1+ parts

$12.241

100+ parts

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851

$12.241

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One Stop Electronics

USA . 1,583 parts In-Stock

1+ parts

$35.500

100+ parts

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1,583

$35.500

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Corphita

USA . 69 parts In-Stock

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69

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Overview

Upgrade your data bus systems with the UCC5680PW28G4 by Texas Instruments. As a leader in semiconductor manufacturing, Texas Instruments guarantees top-quality products that exceed industry standards. This SCSI bus terminator offers reliable performance, increased efficiency, and seamless integration for your applications. With a wide operating temperature range and compact design, this product maximizes space while delivering unmatched value. Trust Texas Instruments to provide you with cutting-edge solutions for all your data bus needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and reliability to the product.

Surface Mount: YES

Enables easy installation and saves space on the PCB.

Maximum Supply Voltage: 5.25 V

Allows for compatibility with a wide range of systems and devices.

Package Shape: RECTANGULAR

Facilitates easier integration into existing designs.

Power Supplies (V): 3/5

Offers flexibility in power input options for different applications.

No. of Terminals: 28

Sufficient number of terminals for connecting various components.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact design with a thin profile makes it suitable for space-constrained environments.

Minimum Supply Voltage: 2.7 V

Works efficiently even at lower supply voltages.

Maximum Operating Temperature: 70 °C

Capable of operating reliably at high temperatures.

Minimum Operating Temperature: 0 °C

Can function in cold temperatures without any issues.

Terminal Finish: NICKEL PALLADIUM GOLD

Ensures good conductivity and corrosion resistance for long-term use.

Terminal Position: DUAL

Dual terminal position for enhanced connectivity and stability.

Maximum Seated Height: 1.2 mm

Low profile design for fitting in tight spaces.

Width: 4.4 mm

Compact width for efficient PCB layout.

Differential Output: YES

Provides improved noise immunity and signal quality.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for easy and quick soldering during assembly.

Peak Reflow Temperature °C: 260

Withstands high temperatures during reflow soldering process.

Length: 9.7 mm

Optimal length for suitable placement on the PCB.

Temperature Grade: COMMERCIAL

Meets standard commercial temperature requirements.

Nominal Pull Up Resistance: 105 ohm

Provides the desired impedance for proper signal termination.

Terminal Form: GULL WING

Gull wing terminal form for easy soldering and connection.

No. of Signal Lines: 9

Suitable for managing multiple signal lines efficiently.

Terminal Pitch: 0.65 mm

Fine terminal pitch for precise connections.

Interface IC Type: SCSI BUS TERMINATOR

Specifically designed for SCSI bus termination, ensuring compatibility and reliable performance.

Technical Specifications

Data Bus Terminators UCC5680PW28G4 attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

YES

Interface IC Type:

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Signal Lines:

9

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Nominal Pull Up Resistance:

105 ohm

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

UCC5680PW28G4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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