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SN74S1051NSRE4

Texas Instruments

SN74S1051NSRE4 by Texas Instruments

SN74S1051NSRE4 by Texas Instruments is a 16-terminal data bus terminator with a small outline package. It operates b/w 0-70°C, has a supply voltage of 5V, and features nickel palladium gold terminal finish. Ideal for diode bus termination arrays in commercial-grade applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,243 parts In-Stock

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7,243

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Digiode

USA . 324 parts In-Stock

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324

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Nova Conductors

Japan . 15 parts In-Stock

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15

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 138 parts In-Stock

1+ parts

$7.408

100+ parts

-

1k+ parts

$7.898

10k+ parts

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138

$7.408

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$7.898

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DigiPath Technology Company

USA . 966 parts In-Stock

1+ parts

$8.158

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966

$8.158

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ChromeModa Solutions

Germany . 5,003 parts In-Stock

1+ parts

$8.324

100+ parts

$6.826

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5,003

$8.324

$6.826

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IDEA Electronic Components Group

UK . 1,706 parts In-Stock

1+ parts

$8.324

100+ parts

$7.908

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$7.492

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1,706

$8.324

$7.908

$7.492

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AZTECH Wire

Italy . 678 parts In-Stock

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$11.659

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678

$11.659

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One Stop Electronics

USA . 1,285 parts In-Stock

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$20.500

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1,285

$20.500

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Ampacity Inc.

Singapore . 528 parts In-Stock

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$25.500

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528

$25.500

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Corphita

USA . 2,359 parts In-Stock

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2,359

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Aranea Global

USA . 1,000 parts In-Stock

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Overview

Enhance the performance of your electronic devices with the SN74S1051NSRE4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability in their products. This data bus terminator is versatile and can be used in a variety of applications, offering customers unmatched value and benefits. Improve signal integrity and reduce noise with this high-quality product, designed to meet the demanding requirements of modern electronics. Trust Texas Instruments for all your semiconductor needs.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Provides durability and resistance to environmental factors.

Surface Mount:

YES - Allows for easy and efficient installation on PCBs.

Package Shape:

RECTANGULAR - Offers a standardized shape for compatibility with various systems.

No. of Terminals:

16 - Provides ample connection points for a range of signal lines.

Package Style (Meter):

SMALL OUTLINE - Saves space and allows for compact designs.

Maximum Operating Temperature:

70 °C - Ensures reliable performance in a wide range of operating conditions.

Minimum Operating Temperature:

0 °C - Suitable for use in both cold and warm environments.

Terminal Finish:

NICKEL PALLADIUM GOLD - Provides corrosion resistance and ensures long-lasting connections.

Terminal Position:

DUAL - Allows for flexibility in installation and connection options.

Maximum Seated Height:

2 mm - Enables installation in low-profile spaces.

Width:

5.3 mm - Offers a compact footprint for efficient PCB layout.

Maximum Time At Peak Reflow Temperature (s):

30 - Ensures proper soldering for reliable connections.

Peak Reflow Temperature °C:

260 - Allows for high-temperature soldering without damaging the product.

Length:

10.2 mm - Provides a standard length for compatibility with various systems.

Temperature Grade:

COMMERCIAL - Suitable for most commercial applications.

Terminal Form:

GULL WING - Facilitates easy soldering and secure connections.

No. of Signal Lines:

12 - Supports a wide range of data bus configurations.

Nominal Supply Voltage:

5 V - Compatible with common voltage systems.

Terminal Pitch:

1.27 mm - Ensures proper spacing for secure connections.

Interface IC Type:

DIODE BUS TERMINATION ARRAY - Ensures proper signal termination for optimal data transmission.

Technical Specifications

Data Bus Terminators SN74S1051NSRE4 attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Signal Lines:

12

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

SN74S1051NSRE4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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