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SN74S1053DBRE4

Texas Instruments

SN74S1053DBRE4 by Texas Instruments

SN74S1053DBRE4 by Texas Instruments is a Data Bus Terminator with 16 signal lines, operating at 5V. It features a small outline package style, Gull Wing terminal form, and nickel palladium gold finish. Ideal for diode bus termination arrays in commercial-grade applications with temp range of 0-70°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,294 parts In-Stock

1+ parts

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4,294

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Digiode

USA . 3,280 parts In-Stock

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3,280

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,651 parts In-Stock

1+ parts

$10.954

100+ parts

-

1k+ parts

$11.418

10k+ parts

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1,651

$10.954

-

$11.418

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DigiPath Technology Company

USA . 28 parts In-Stock

1+ parts

$12.062

100+ parts

$11.097

1k+ parts

-

10k+ parts

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28

$12.062

$11.097

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ChromeModa Solutions

Germany . 4,247 parts In-Stock

1+ parts

$12.308

100+ parts

$10.093

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-

10k+ parts

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4,247

$12.308

$10.093

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IDEA Electronic Components Group

UK . 2,222 parts In-Stock

1+ parts

$12.308

100+ parts

$11.693

1k+ parts

$11.077

10k+ parts

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2,222

$12.308

$11.693

$11.077

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AZTECH Wire

Italy . 489 parts In-Stock

1+ parts

$19.570

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489

$19.570

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One Stop Electronics

USA . 887 parts In-Stock

1+ parts

$21.500

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887

$21.500

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Corphita

USA . 2,087 parts In-Stock

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2,087

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Overview

Elevate your data bus terminators to the next level with the SN74S1053DBRE4 by Texas Instruments. Made with top-quality materials and expert craftsmanship, this product ensures reliable performance and durability. Perfect for a wide range of applications, this small outline, shrink pitch package offers dual terminal positions and a nickel palladium gold finish for optimal connectivity. Experience the value and benefits of Texas Instruments' cutting-edge technology with the SN74S1053DBRE4 - the ultimate solution for your data bus termination needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the terminator.

Surface Mount: YES

Allows for easy installation on PCBs, saving time and effort during assembly.

No. of Terminals: 20

Provides ample connectivity options for various data bus configurations.

Maximum Operating Temperature: 70 °C

Ensures reliable performance even in high-temperature environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Offers excellent conductivity and corrosion resistance for long-lasting use.

Width: 5.3 mm

Compact size fits well in crowded PCB layouts, saving space.

Nominal Supply Voltage: 5 V

Compatible with standard 5V power sources commonly used in electronic devices.

Technical Specifications

Data Bus Terminators SN74S1053DBRE4 attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

7.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Signal Lines:

16

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

SN74S1053DBRE4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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