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SN74S1056DR

Texas Instruments

SN74S1056DR by Texas Instruments

SN74S1056DR by Texas Instruments is a Data Bus Terminator with 8 signal lines and 16 terminals. It operates at temperatures b/w 0°C to 70°C, suitable for commercial applications. This small outline IC has a supply voltage of 5V and Gull Wing terminal form, making it ideal for diode bus termination arrays in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,945 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,945

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-

-

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Vyrian

USA . 1,952 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,952

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-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 527 parts In-Stock

1+ parts

$8.303

100+ parts

-

1k+ parts

$8.925

10k+ parts

-

527

$8.303

-

$8.925

-

ChromeModa Solutions

Germany . 5,660 parts In-Stock

1+ parts

$9.329

100+ parts

$7.650

1k+ parts

-

10k+ parts

-

5,660

$9.329

$7.650

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-

IDEA Electronic Components Group

UK . 698 parts In-Stock

1+ parts

$9.329

100+ parts

$8.863

1k+ parts

$8.396

10k+ parts

-

698

$9.329

$8.863

$8.396

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AZTECH Wire

Italy . 747 parts In-Stock

1+ parts

$14.271

100+ parts

-

1k+ parts

-

10k+ parts

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747

$14.271

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-

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One Stop Electronics

USA . 570 parts In-Stock

1+ parts

$15.500

100+ parts

-

1k+ parts

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10k+ parts

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570

$15.500

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-

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Corphita

USA . 2,923 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,923

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DigiPath Technology Company

USA . 2,299 parts In-Stock

1+ parts

-

100+ parts

$8.411

1k+ parts

-

10k+ parts

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2,299

-

$8.411

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Overview

Enhance your data bus system with the SN74S1056DR by Texas Instruments. This high-quality diode bus termination array offers reliable performance and seamless integration, making it a top choice for various applications. With its compact size and dual terminal position, this product provides convenience and efficiency in your projects. Trust Texas Instruments to deliver exceptional products that meet your needs and exceed your expectations. Upgrade your system today with the SN74S1056DR and experience the value and benefits it brings to your operations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and secure installation on circuit boards, saving time and effort.

Maximum Operating Temperature: 70 °C

Ensures reliable performance even in high-temperature environments.

No. of Signal Lines: 8

Sufficient number of signal lines for data transmission, supporting complex communication protocols.

Nominal Supply Voltage: 5 V

Compatible with common voltage standards, making it versatile for different applications.

Technical Specifications

Data Bus Terminators SN74S1056DR attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

No. of Functions:

1

No. of Signal Lines:

8

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SN74S1056DR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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