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UC5612PWPTR

Texas Instruments

UC5612PWPTR by Texas Instruments

UC5612PWPTR by Texas Instruments is a SCSI bus terminator with 24 terminals. It operates b/w 0-70°C, with supply voltage range of 3.8-5.25V and pull-up resistance of 110Ω. Ideal for data bus termination in commercial applications due to its compact size and dual terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,048 parts In-Stock

1+ parts

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7,048

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Digiode

USA . 1,801 parts In-Stock

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1,801

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 492 parts In-Stock

1+ parts

$3.842

100+ parts

-

1k+ parts

$4.328

10k+ parts

-

492

$3.842

-

$4.328

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DigiPath Technology Company

USA . 2,101 parts In-Stock

1+ parts

$4.231

100+ parts

$3.892

1k+ parts

-

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2,101

$4.231

$3.892

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ChromeModa Solutions

Germany . 5,015 parts In-Stock

1+ parts

$4.317

100+ parts

$3.540

1k+ parts

-

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5,015

$4.317

$3.540

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IDEA Electronic Components Group

UK . 756 parts In-Stock

1+ parts

$4.317

100+ parts

-

1k+ parts

$3.885

10k+ parts

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756

$4.317

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$3.885

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AZTECH Wire

Italy . 801 parts In-Stock

1+ parts

$8.077

100+ parts

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801

$8.077

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One Stop Electronics

USA . 1,624 parts In-Stock

1+ parts

$12.500

100+ parts

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1,624

$12.500

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Corphita

USA . 599 parts In-Stock

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599

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Kepictronics

USA . 33 parts In-Stock

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Overview

Enhance the efficiency and reliability of your data bus systems with the Texas Instruments UC5612PWPTR. Manufactured with precision and quality in mind, this SCSI bus terminator offers unparalleled performance and durability. Whether you're working on industrial automation or telecommunications applications, this high-quality data bus terminator ensures seamless communication and optimal signal integrity. Trust Texas Instruments to deliver cutting-edge technology that surpasses expectations, providing you with the value and advantages you need to succeed in today's competitive market. Elevate your projects with the UC5612PWPTR and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight yet durable material for the package, ensuring the product is easy to handle and long-lasting.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 5.25 V

Can handle high voltage inputs, providing a margin of safety for the connected components.

Package Shape: RECTANGULAR

Offers a standard shape that fits well in typical electronic setups, making it easy to integrate into existing systems.

Power Supplies (V): 5

Operates on commonly available power supply voltages, ensuring compatibility with a wide range of devices.

No. of Terminals: 24

Provides ample connectivity options for interfacing with multiple signal lines, facilitating complex data bus configurations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact design with a thin profile saves space on the circuit board and allows for dense packing of components.

Minimum Supply Voltage: 3.8 V

Operates efficiently even at lower supply voltages, ensuring energy savings and reliable performance.

Maximum Operating Temperature: 70 °C

Can withstand high operating temperatures, suitable for use in various environments without performance degradation.

Minimum Operating Temperature: 0 °C

Operates reliably at low temperatures, making it suitable for applications in cold environments.

Terminal Position: DUAL

Provides redundancy in signal connections, ensuring stability and reliability in data transmission.

Maximum Seated Height: 1.2 mm

Low-profile design allows for compact installations in tight spaces, ideal for space-constrained applications.

Width: 4.4 mm

Narrow width facilitates close placement of multiple terminators on a circuit board, optimizing signal routing and layout.

Length: 7.8 mm

Compact length ensures efficient use of board space, enabling a high-density layout for complex electronic systems.

Temperature Grade: COMMERCIAL

Suitable for standard commercial applications, offering cost-effective performance for a wide range of uses.

Nominal Pull Up Resistance: 110 ohm

Provides the appropriate resistance for signal conditioning, ensuring signal integrity and minimizing interference.

Technology: BIPOLAR

Utilizes bipolar technology for reliable signal processing and low noise operation, ensuring high-quality data transmission.

Terminal Form: GULL WING

Gull wing terminals provide secure solder connections, enhancing the durability and longevity of the product.

No. of Signal Lines: 9

Supports multiple signal lines for versatile data bus configurations, enabling complex communication protocols.

Nominal Supply Voltage: 4.75 V

Operates at an optimal supply voltage level, ensuring stable performance and compatibility with standard power sources.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for high-density mounting of components, enabling compact and efficient circuit board designs.

Interface IC Type: SCSI BUS TERMINATOR

Specifically designed for SCSI bus termination, ensuring compatibility and reliable operation in SCSI-based systems.

Technical Specifications

Data Bus Terminators UC5612PWPTR attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PDSO-G24

Length:

7.8 mm

No. of Functions:

1

No. of Signal Lines:

9

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Nominal Pull Up Resistance:

110 ohm

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

4.75 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

UC5612PWPTR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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