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SN74ACT1071DRG4

Texas Instruments

SN74ACT1071DRG4 by Texas Instruments

SN74ACT1071DRG4 by Texas Instruments is a CMOS technology-based Data Bus Terminator with 10 signal lines. It operates b/w -40 to 85 °C and has a supply voltage range of 4.5V to 5.5V, drawing a max current of 0.04 mA. This IC is ideal for industrial applications requiring diode bus termination arrays in compact SMD packages.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,870 parts In-Stock

1+ parts

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3,870

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Digiode

USA . 1,392 parts In-Stock

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1,392

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,488 parts In-Stock

1+ parts

$5.933

100+ parts

-

1k+ parts

$6.716

10k+ parts

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1,488

$5.933

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$6.716

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DigiPath Technology Company

USA . 979 parts In-Stock

1+ parts

$6.533

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-

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979

$6.533

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ChromeModa Solutions

Germany . 976 parts In-Stock

1+ parts

$6.666

100+ parts

$5.466

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976

$6.666

$5.466

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IDEA Electronic Components Group

UK . 677 parts In-Stock

1+ parts

$6.666

100+ parts

-

1k+ parts

$5.999

10k+ parts

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677

$6.666

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$5.999

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AZTECH Wire

Italy . 302 parts In-Stock

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$17.126

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302

$17.126

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One Stop Electronics

USA . 1,442 parts In-Stock

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$24.500

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1,442

$24.500

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Corphita

USA . 4,638 parts In-Stock

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Overview

Enhance your data bus performance with the SN74ACT1071DRG4 by Texas Instruments. As a trusted industry leader, Texas Instruments delivers top-quality products that are designed to optimize data transmission and improve overall system efficiency. The SN74ACT1071DRG4 is a versatile solution for a wide range of applications in various industries, offering unparalleled reliability and performance. Experience seamless operation and enhanced functionality with this cutting-edge data bus terminator. Upgrade your systems today and stay ahead of the competition with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to environmental factors, making the product suitable for various applications.

Surface Mount: YES

Ease of installation and compact design for efficient use of PCB space.

Maximum Supply Voltage: 5.5 V

Supports a wide range of voltage inputs, enhancing compatibility with different systems.

Temperature Grade: INDUSTRIAL

Designed to operate in industrial environments, ensuring reliability in harsh conditions.

No. of Terminals: 14

Sufficient terminals for connecting multiple signal lines, reducing the need for additional components.

Nominal Supply Voltage: 5 V

Stable supply voltage for consistent performance of the data bus terminator.

Technology: CMOS

Utilizes CMOS technology for low power consumption and efficient operation.

Interface IC Type: DIODE BUS TERMINATION ARRAY

Specifically designed for bus termination, ensuring optimal signal integrity and communication reliability.

Technical Specifications

Data Bus Terminators SN74ACT1071DRG4 attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Signal Lines:

10

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Bus Terminators

Maximum Supply Current:

.04 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

SN74ACT1071DRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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