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UCC5630AFQP

Texas Instruments

UCC5630AFQP by Texas Instruments

UCC5630AFQP by Texas Instruments is a Data Bus Terminator with 48 terminals, operating at 2.7-5.25V. It features BICMOS technology, differential output, and SCSI interface type for commercial applications requiring a low-profile flatpack package with fine pitch terminals.

Median Price

$3.987

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,189 parts In-Stock

1+ parts

-

100+ parts

$3.190

1k+ parts

$2.860

10k+ parts

$2.690

3,189

-

$3.190

$2.860

$2.690

Verical

USA . 1,395 parts In-Stock

1+ parts

-

100+ parts

$3.987

1k+ parts

$3.575

10k+ parts

$3.362

1,395

-

$3.987

$3.575

$3.362

DigiKey

USA . 108 parts In-Stock

1+ parts

-

100+ parts

$4.200

1k+ parts

-

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108

-

$4.200

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,864 parts In-Stock

1+ parts

$3.363

100+ parts

-

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2,864

$3.363

-

-

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Vyrian

USA . 4,277 parts In-Stock

1+ parts

$3.540

100+ parts

-

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4,277

$3.540

-

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DigiKey Marketplace

USA . 3,199 parts In-Stock

1+ parts

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3,199

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LIBRA Elektronik GmbH

Germany . 209 parts In-Stock

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209

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R&J Components

USA . 150 parts In-Stock

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150

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Elcom Components

USA . 20 parts In-Stock

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20

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Inventory MP

USA . 7 parts In-Stock

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7

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Bristol Electronics

USA . 7 parts In-Stock

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7

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Electronic Expediters

USA . 6 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,505 parts In-Stock

1+ parts

$3.186

100+ parts

-

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4,505

$3.186

-

-

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Parana Technologies

USA . 1,501 parts In-Stock

1+ parts

$3.533

100+ parts

-

1k+ parts

$4.057

10k+ parts

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1,501

$3.533

-

$4.057

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DigiPath Technology Company

USA . 1,901 parts In-Stock

1+ parts

$3.891

100+ parts

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1,901

$3.891

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ChromeModa Solutions

Germany . 392 parts In-Stock

1+ parts

$3.970

100+ parts

$3.255

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392

$3.970

$3.255

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IDEA Electronic Components Group

UK . 80 parts In-Stock

1+ parts

$3.970

100+ parts

-

1k+ parts

$3.573

10k+ parts

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80

$3.970

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$3.573

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A-Z Elektronik GmbH

Germany . 4,659 parts In-Stock

1+ parts

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4,659

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Microchip USA

USA . 1,683 parts In-Stock

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1,683

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Perfect Parts

USA . 258 parts In-Stock

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258

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Kepictronics

USA . 95 parts In-Stock

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95

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Overview

Discover the UCC5630AFQP by Texas Instruments, a top-tier manufacturer known for its cutting-edge technology and reliable products. This data bus terminator is designed to provide seamless integration and optimal performance in various applications. With a focus on quality and innovation, this product offers customers unmatched value, benefits, and advantages. Whether you're looking to enhance your system's efficiency or streamline your operations, the UCC5630AFQP delivers unparalleled reliability and functionality that will exceed your expectations. Elevate your projects with this high-quality solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package durable and resistant to wear and tear, ensuring a long lifespan for the product.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage supports compatibility with a wide range of systems, offering versatility in usage.

Package Shape: SQUARE

The square package shape facilitates uniform and compact placement on the board, optimizing space utilization.

Power Supplies (V): 3/5

Support for both 3V and 5V power supplies allows flexibility in connecting to different power sources as needed.

No. of Terminals: 48

The abundant terminals enable connectivity with multiple other components, enhancing the functionality of the product.

Minimum Supply Voltage: 2.7 V

The low minimum supply voltage ensures efficient power utilization and operation at lower power levels.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature tolerance ensures reliability and stability even in elevated temperature environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish provides excellent conductivity and corrosion resistance, ensuring reliable connections over time.

Terminal Position: QUAD

The quad terminal position allows for stable and secure mounting on the board, minimizing the risk of disconnections or disruptions.

Width: 7 mm

The compact width of 7mm enables easy integration into tight spaces or layouts, enhancing the versatility of installation.

Differential Output: YES

Differential output capability improves signal integrity and noise immunity, leading to more reliable data transmission.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature ensures quick and efficient soldering, reducing the risk of heat damage to the product.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance allows for robust soldering processes without compromising the product's integrity.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates suitability for standard operating environments, making it a reliable choice for various applications.

Nominal Pull Up Resistance: 105 ohm

The nominal pull-up resistance value helps maintain signal integrity and stability, ensuring accurate data transmission.

Technology: BICMOS

The BICMOS technology combines the benefits of both bipolar and CMOS technologies, offering high performance and low power consumption.

Terminal Form: GULL WING

The gull-wing terminal form provides mechanical strength and ease of soldering, ensuring reliable connections on the board.

No. of Signal Lines: 9

The 9 signal lines support multiple data transmission functions, making the product suitable for complex communication protocols.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V ensures compatibility with standard power sources, simplifying system integration.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for dense packing of components on the board, maximizing space efficiency.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates moderate sensitivity to moisture, suggesting appropriate handling and storage precautions for longevity.

Interface IC Type: SCSI BUS TERMINATOR

The SCSI bus terminator interface IC type ensures compatibility with SCSI (Small Computer System Interface) bus systems, meeting industry standards for connectivity.

Technical Specifications

Data Bus Terminators UCC5630AFQP attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

YES

Interface IC Type:

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Signal Lines:

9

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Nominal Pull Up Resistance:

105 ohm

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

UCC5630AFQP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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