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UC5613J

Texas Instruments

UC5613J by Texas Instruments

UC5613J by Texas Instruments is a SCSI bus terminator with 16 terminals, operating voltage range of 3.8V to 5.25V, and pull-up resistance of 110 ohm. It is designed for commercial-grade applications requiring bipolar technology and a rectangular package style with ceramic-metal body material.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,963 parts In-Stock

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Digiode

USA . 987 parts In-Stock

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Parana Technologies

USA . 2,068 parts In-Stock

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$4.334

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$4.755

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2,068

$4.334

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$4.755

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IDEA Electronic Components Group

UK . 1,609 parts In-Stock

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$4.870

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$4.383

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ChromeModa Solutions

Germany . 323 parts In-Stock

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$4.870

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$3.993

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323

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$3.993

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AZTECH Wire

Italy . 666 parts In-Stock

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$14.671

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One Stop Electronics

USA . 728 parts In-Stock

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$16.500

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Corphita

USA . 1,305 parts In-Stock

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DigiPath Technology Company

USA . 281 parts In-Stock

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$4.391

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Overview

Unlock the potential of your data bus with the UC5613J by Texas Instruments. Crafted with precision and expertise, this high-quality terminator offers unparalleled performance and reliability, ensuring seamless communication within your system. Whether you're in the industrial, automotive, or telecommunications sector, this versatile device is designed to meet your needs. Experience the value of superior technology and innovation with the UC5613J, where quality meets functionality. Elevate your systems with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This package body material provides durability and reliability, making the product suitable for harsh environments.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage ensures compatibility with a wide range of systems and prevents damage from voltage spikes.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration and mounting within electronic systems.

Power Supplies (V): 5

The product operates at a standard power supply voltage of 5V, making it compatible with common electronic devices.

No. of Terminals: 16

With 16 terminals, this product can efficiently terminate multiple data bus connections.

Package Style (Meter): IN-LINE

The in-line package style makes it easy to connect the terminator in a linear configuration, saving space in the system layout.

Minimum Supply Voltage: 3.8 V

The low minimum supply voltage ensures reliable operation even in low power situations.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this terminator can withstand heat and maintain performance in challenging environments.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures that the terminator can function in various temperature conditions.

Terminal Position: DUAL

The dual terminal position allows for flexibility in connecting the terminator to different types of interfaces.

Maximum Seated Height: 5.08 mm

The low maximum seated height enables the product to be compact and fit into tight spaces within electronic systems.

Width: 7.62 mm

The moderate width of the terminator makes it easy to integrate into a variety of system designs.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures reliable performance in standard operating conditions.

Nominal Pull Up Resistance: 110 ohm

The specified pull up resistance value ensures proper termination of the data bus signals, reducing interference and signal degradation.

Technology: BIPOLAR

The bipolar technology used in this terminator provides high-speed data transmission and accuracy in signal termination.

Terminal Form: THROUGH-HOLE

The through-hole terminal form facilitates easy installation and secure connectivity in electronic assemblies.

No. of Signal Lines: 9

With 9 signal lines, this terminator can effectively manage data transmission and termination for multiple signal pathways.

Nominal Supply Voltage: 4.75 V

The specified nominal supply voltage ensures stable and reliable performance of the terminator within the recommended voltage range.

Terminal Pitch: 2.54 mm

The standard terminal pitch of 2.54mm allows for easy connection of the terminator to other components on a circuit board.

Interface IC Type: SCSI BUS TERMINATOR

This terminator is specifically designed for SCSI bus systems, ensuring compatibility and optimal performance in SCSI data transmission applications.

Technical Specifications

Data Bus Terminators UC5613J attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-CDIP-T16

No. of Functions:

1

No. of Signal Lines:

9

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Nominal Pull Up Resistance:

110 ohm

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

4.75 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

UC5613J Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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