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UCC5640PW24TR

Texas Instruments

UCC5640PW24TR by Texas Instruments

UCC5640PW24TR by Texas Instruments is a SCSI bus terminator with 24 terminals and a supply voltage range of 2.7V to 5.25V. It features a BICMOS technology, differential output, and nominal pull-up resistance of 105 ohm. Ideal for data bus termination applications in commercial-grade environments with its compact thin profile package design.

Median Price

$3.188

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 100,000 parts In-Stock

1+ parts

-

100+ parts

$2.850

1k+ parts

$2.550

10k+ parts

$2.400

100,000

-

$2.850

$2.550

$2.400

DigiKey

USA . 100,000 parts In-Stock

1+ parts

-

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$3.750

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$3.750

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Verical

USA . 100,000 parts In-Stock

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$3.188

10k+ parts

$3.000

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$3.188

$3.000

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 550 parts In-Stock

1+ parts

$2.280

100+ parts

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550

$2.280

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Vyrian

USA . 4,854 parts In-Stock

1+ parts

$2.400

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4,854

$2.400

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Electronics Depot

USA . 100,000 parts In-Stock

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Extreme Components

USA . 1,039 parts In-Stock

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1,039

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Distributors (Availability)

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Corphita

USA . 491 parts In-Stock

1+ parts

$2.160

100+ parts

-

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491

$2.160

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Parana Technologies

USA . 313 parts In-Stock

1+ parts

$12.983

100+ parts

$1,205.698

1k+ parts

$11.685

10k+ parts

-

313

$12.983

$1,205.698

$11.685

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DigiPath Technology Company

USA . 64 parts In-Stock

1+ parts

$14.296

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64

$14.296

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ChromeModa Solutions

Germany . 2,818 parts In-Stock

1+ parts

$14.588

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$11.962

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2,818

$14.588

$11.962

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IDEA Electronic Components Group

UK . 2,274 parts In-Stock

1+ parts

$14.588

100+ parts

$13.859

1k+ parts

$13.129

10k+ parts

-

2,274

$14.588

$13.859

$13.129

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Microchip USA

USA . 2,981 parts In-Stock

1+ parts

$15.090

100+ parts

$15.000

1k+ parts

$14.950

10k+ parts

$14.900

2,981

$15.090

$15.000

$14.950

$14.900

QUARKTWIN TECHNOLOGY LTD

USA . 24,843 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,428 parts In-Stock

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6,428

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Kepictronics

USA . 1,400 parts In-Stock

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1,400

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Metaverse IC Inc.

Canada . 655 parts In-Stock

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655

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Perfect Parts

USA . 560 parts In-Stock

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560

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Overview

Unlock the power of seamless data transmission with the UCC5640PW24TR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers unparalleled quality and reliability in their products. The UCC5640PW24TR falls under the category of Data Bus Terminators and is designed to optimize performance in various applications. With its compact package style and advanced BICMOS technology, this product offers customers exceptional value, efficiency, and precision. Experience the benefits of smooth communication and enhanced connectivity with the UCC5640PW24TR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components, ensuring a long lifespan for the product.

Surface Mount: YES

Surface mount design allows for easy installation onto circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage of 5.25 V allows for compatibility with a wide range of devices and systems.

Power Supplies (V): 3/5

Support for both 3V and 5V power supplies ensures flexibility in system integration, making it versatile for different applications.

No. of Terminals: 24

With 24 terminals, this product can efficiently handle a large number of connections, enhancing its functionality in data bus termination.

Minimum Supply Voltage: 2.7 V

The low minimum supply voltage of 2.7 V ensures efficient power usage and compatibility with various power sources.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C enables reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures that the product can function effectively in a wide range of temperature settings.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish enhances conductivity and corrosion resistance, ensuring stable and reliable connections.

Maximum Seated Height: 1.2 mm

The low maximum seated height of 1.2 mm allows for a compact design that saves space on the circuit board.

Differential Output: YES

Differential output helps in reducing electromagnetic interference and noise, resulting in cleaner and more reliable signal transmission.

Terminal Position: DUAL

Dual terminal position provides redundancy and ensures reliable connections, enhancing the overall performance and durability of the product.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature ensures proper soldering and mounting of the product onto the circuit board.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C ensures secure solder joints and reliable performance during manufacturing processes.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates that the product is suitable for standard commercial applications, offering reliability and consistent performance.

Nominal Pull Up Resistance: 105 ohm

The nominal pull-up resistance of 105 ohms helps in maintaining signal integrity and reducing signal distortion in data bus termination.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS technologies, providing high-speed operation and low power consumption.

Terminal Form: GULL WING

Gull wing terminal form offers mechanical stability and secure connections, ensuring reliable performance in various environmental conditions.

No. of Signal Lines: 9

Support for 9 signal lines allows for efficient management and transmission of data in data bus termination applications.

Maximum Supply Current: 25 mA

Low maximum supply current of 25 mA helps in conserving power and reducing energy consumption in the system.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage of 3.3 V provides a stable power source for the product, ensuring consistent performance and reliability.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65 mm allows for high-density mounting and compact design, saving space on the circuit board.

Interface IC Type: SCSI BUS TERMINATOR

Specialized interface IC type for SCSI bus termination ensures compatibility and efficient data handling in SCSI-based systems.

Technical Specifications

Data Bus Terminators UCC5640PW24TR attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

YES

Interface IC Type:

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

7.8 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Signal Lines:

9

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Nominal Pull Up Resistance:

105 ohm

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Terminators

Maximum Supply Current:

25 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

UCC5640PW24TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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