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UC5608DWPTR/81168

Texas Instruments

UC5608DWPTR/81168 by Texas Instruments

UC5608DWPTR/81168 by Texas Instruments is a Data Bus Terminator with 28 terminals, operating at 0-70°C. It features a supply voltage range of 4-5.25V and pull-up resistance of 110Ω. Ideal for SCSI bus termination applications due to its bipolar technology and Gull Wing terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,607 parts In-Stock

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7,607

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Digiode

USA . 892 parts In-Stock

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892

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Distributors (Availability)

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Parana Technologies

USA . 2,130 parts In-Stock

1+ parts

$2.602

100+ parts

-

1k+ parts

$3.093

10k+ parts

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2,130

$2.602

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$3.093

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ChromeModa Solutions

Germany . 649 parts In-Stock

1+ parts

$2.924

100+ parts

$2.398

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649

$2.924

$2.398

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IDEA Electronic Components Group

UK . 645 parts In-Stock

1+ parts

$2.924

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$2.632

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645

$2.924

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$2.632

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One Stop Electronics

USA . 1,034 parts In-Stock

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$5.500

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1,034

$5.500

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AZTECH Wire

Italy . 818 parts In-Stock

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$8.084

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818

$8.084

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Corphita

USA . 1,834 parts In-Stock

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1,834

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DigiPath Technology Company

USA . 1,045 parts In-Stock

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$2.636

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1,045

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$2.636

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Overview

Unlock the power of seamless data transmission with the UC5608DWPTR/81168 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers unparalleled quality and reliability in their products. Designed for data bus terminators, this innovative solution offers a wide range of applications in various industries. Experience the value and benefits of this product, from its compact package design to its high-performance technology. Trust Texas Instruments to provide you with the cutting-edge solutions you need to stay ahead of the competition. Elevate your data transmission experience with the UC5608DWPTR/81168.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the data bus terminator, ensuring long-lasting performance.

Surface Mount: YES

Being surface mountable makes it easy to integrate this data bus terminator onto a PCB for efficient installation and space-saving design.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage allows for reliable operation within a wide range of voltage inputs, increasing compatibility with different systems.

No. of Terminals: 28

With a higher number of terminals, this data bus terminator can support more connections and signals, making it suitable for complex data bus systems.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures that this data bus terminator can function effectively even in cold environments, increasing its versatility.

Nominal Pull Up Resistance: 110 ohm

The specified pull up resistance helps maintain signal integrity and prevent interference in data transmission, making this data bus terminator a reliable choice.

Interface IC Type: SCSI BUS TERMINATOR

Designed specifically for SCSI bus termination, this data bus terminator is tailored for optimal performance in SCSI data bus systems, ensuring compatibility and efficiency.

Technical Specifications

Data Bus Terminators UC5608DWPTR/81168 attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PDSO-G28

Length:

17.9 mm

No. of Functions:

1

No. of Signal Lines:

18

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Nominal Pull Up Resistance:

110 ohm

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4 V

Nominal Supply Voltage:

4.75 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

UC5608DWPTR/81168 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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