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SN74S1052DWRE4

Texas Instruments

SN74S1052DWRE4 by Texas Instruments

SN74S1052DWRE4 by Texas Instruments is a Data Bus Terminator with 16 signal lines and 20 terminals. It operates at temperatures b/w 0°C to 70°C, with a supply voltage of 5V. This small outline package is ideal for diode bus termination arrays in commercial-grade applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,378 parts In-Stock

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6,378

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Digiode

USA . 578 parts In-Stock

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578

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 945 parts In-Stock

1+ parts

$5.318

100+ parts

-

1k+ parts

$5.961

10k+ parts

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945

$5.318

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$5.961

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DigiPath Technology Company

USA . 1,382 parts In-Stock

1+ parts

$5.856

100+ parts

$5.387

1k+ parts

-

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1,382

$5.856

$5.387

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ChromeModa Solutions

Germany . 3,857 parts In-Stock

1+ parts

$5.975

100+ parts

$4.900

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-

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3,857

$5.975

$4.900

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IDEA Electronic Components Group

UK . 2,182 parts In-Stock

1+ parts

$5.975

100+ parts

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$5.378

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2,182

$5.975

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$5.378

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AZTECH Wire

Italy . 835 parts In-Stock

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$18.128

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835

$18.128

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One Stop Electronics

USA . 980 parts In-Stock

1+ parts

$38.500

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980

$38.500

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Corphita

USA . 3,832 parts In-Stock

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Microchip USA

USA . 383 parts In-Stock

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383

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Overview

Unlock the power of seamless data transmission with the SN74S1052DWRE4 by Texas Instruments. Crafted with precision and quality, this small outline package is designed for commercial-grade applications. With 16 signal lines and a nominal supply voltage of 5V, this diode bus termination array offers unparalleled reliability and efficiency. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations. Elevate your projects with the SN74S1052DWRE4 and experience superior performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

No. of Terminals: 20

With a higher number of terminals, this product can accommodate more connections, making it suitable for complex data bus systems.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance even in harsh environments with elevated temperatures.

Nominal Supply Voltage: 5 V

The 5V supply voltage is a common standard in many electronic systems, making this product compatible with a wide range of devices.

Technical Specifications

Data Bus Terminators SN74S1052DWRE4 attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

No. of Functions:

1

No. of Signal Lines:

16

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

SN74S1052DWRE4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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