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SN74S1050DR

Texas Instruments

SN74S1050DR by Texas Instruments

SN74S1050DR by Texas Instruments is a small outline diode bus termination array with 12 signal lines and 16 terminals. It operates at temperatures b/w 0°C to 70°C, suitable for commercial applications. With a nominal voltage of 5V, it is ideal for data bus termination in electronic systems.

Median Price

$2.980

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DF Sales Co.

USA . 63 parts In-Stock

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$2.980

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$2.980

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DF Sales Co.

USA . 63 parts In-Stock

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$2.980

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63

$2.980

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Vyrian

USA . 7,940 parts In-Stock

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Digiode

USA . 2,805 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 444 parts In-Stock

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$5.182

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444

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Parana Technologies

USA . 2,017 parts In-Stock

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$11.710

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$12.102

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2,017

$11.710

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$12.102

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DigiPath Technology Company

USA . 1,042 parts In-Stock

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$12.894

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1,042

$12.894

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IDEA Electronic Components Group

UK . 1,251 parts In-Stock

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$13.157

100+ parts

$12.499

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$11.841

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1,251

$13.157

$12.499

$11.841

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ChromeModa Solutions

Germany . 1,161 parts In-Stock

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$13.157

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$10.789

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One Stop Electronics

USA . 883 parts In-Stock

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$46.500

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883

$46.500

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Corphita

USA . 1,343 parts In-Stock

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Kepictronics

USA . 500 parts In-Stock

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Microchip USA

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Overview

Enhance your data bus systems with the SN74S1050DR by Texas Instruments. Crafted with precision and quality, this small outline rectagular package offers superior performance and reliability. Ideal for applications requiring diode bus termination arrays, this product ensures seamless connectivity and efficient data transmission. With a commercial temperature grade and 12 signal lines, the SN74S1050DR provides value and benefits that exceed expectations. Upgrade your systems today with Texas Instruments' trusted technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material provides durability and reliability for long-term use.

Surface Mount: YES

Enables easy and efficient installation on PCBs without the need for additional hardware.

Package Shape: RECTANGULAR

Rectangular shape allows for space-efficient placement on circuit boards.

No. of Terminals: 16

Provides ample connectivity options for multiple signal lines.

Maximum Operating Temperature: 70 °C

Suitable for operation in various environmental conditions without overheating.

Minimum Operating Temperature: 0 °C

Can function reliably in low-temperature environments as well.

No. of Signal Lines: 12

Supports a range of signal lines for comprehensive data transmission.

Nominal Supply Voltage: 5 V

Compatible with standard 5V power sources for easy integration in existing systems.

Technical Specifications

Data Bus Terminators SN74S1050DR attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

No. of Functions:

1

No. of Signal Lines:

12

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SN74S1050DR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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