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UCC5672PWPTRG4

Texas Instruments

UCC5672PWPTRG4 by Texas Instruments

UCC5672PWPTRG4 by Texas Instruments is a SCSI bus terminator with 28 terminals, operating at 3.3V nominal voltage and 35mA supply current. It features a BICMOS technology, differential output, and 105 ohm pull-up resistance. This device is designed for data bus termination applications in commercial-grade environments with a temperature range of 0-70°C.

Median Price

$3.080

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 1,093 parts In-Stock

1+ parts

$3.080

100+ parts

$2.310

1k+ parts

$2.000

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1,093

$3.080

$2.310

$2.000

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Vyrian

USA . 5,547 parts In-Stock

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Semi Source

USA . 1,579 parts In-Stock

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1,579

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Digiode

USA . 147 parts In-Stock

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147

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 362 parts In-Stock

1+ parts

$3.589

100+ parts

-

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$4.108

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362

$3.589

-

$4.108

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ChromeModa Solutions

Germany . 3,595 parts In-Stock

1+ parts

$4.033

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$3.307

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3,595

$4.033

$3.307

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IDEA Electronic Components Group

UK . 338 parts In-Stock

1+ parts

$4.033

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$3.630

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338

$4.033

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$3.630

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AZTECH Wire

Italy . 609 parts In-Stock

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$6.189

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609

$6.189

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Ampacity Inc.

Singapore . 889 parts In-Stock

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$26.500

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889

$26.500

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One Stop Electronics

USA . 292 parts In-Stock

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$38.500

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Lixinc

USA . 4,323 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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3,000

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DigiPath Technology Company

USA . 1,979 parts In-Stock

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$3.636

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Kepictronics

USA . 1,858 parts In-Stock

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Corphita

USA . 1,646 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,601 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Microchip USA

USA . 169 parts In-Stock

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Overview

Enhance your data bus systems with the UCC5672PWPTRG4 by Texas Instruments, a top-tier manufacturer known for its superior quality and reliability in the industry. This small outline, thin profile package offers high performance and precision, making it ideal for various applications in SCSI bus terminators. With a nominal pull-up resistance of 105 ohms and a maximum supply current of 35mA, this product delivers exceptional value, efficiency, and functionality to meet all your data bus termination needs. Upgrade your systems today with Texas Instruments' UCC5672PWPTRG4 for seamless and reliable operation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes this terminator lightweight and durable, ideal for long-term use.

Surface Mount: YES

This surface mount feature allows for easy installation and saves space on the PCB, making it a convenient choice for compact designs.

Maximum Supply Voltage: 5.25 V

With a high maximum supply voltage, this terminator can handle voltage spikes and fluctuations, ensuring reliable performance in varying conditions.

Package Shape: RECTANGULAR

The rectangular package shape provides compatibility with standard PCB layouts, simplifying integration into existing systems.

Power Supplies (V): 3/5

This terminator is versatile, able to operate on both 3V and 5V power supplies, offering flexibility in different application scenarios.

No. of Terminals: 28

With 28 terminals, this terminator can effectively handle multiple signal lines, making it suitable for complex data bus systems.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style reduce the overall footprint, optimizing space utilization on the PCB.

Minimum Supply Voltage: 2.7 V

The low minimum supply voltage ensures compatibility with a wide range of power sources, enhancing the versatility of this terminator.

Maximum Operating Temperature: 70 °C

Operating at up to 70°C, this terminator can withstand high temperatures, suitable for industrial environments.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0°C, this terminator is ideal for both cold and warm climates, ensuring consistent performance in various conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides enhanced conductivity and corrosion resistance, contributing to the terminator's long-term reliability.

Terminal Position: DUAL

The dual terminal position offers redundancy and improved signal transmission, making this terminator a reliable choice for critical data bus systems.

Maximum Seated Height: 1.2 mm

The low maximum seated height minimizes the overall profile of the terminator, allowing for compact and space-efficient PCB designs.

Width: 4.4 mm

The narrow width of 4.4 mm enables tight spacing between components on the PCB, optimizing layout efficiency and reducing signal interference.

Differential Output: YES

Featuring a differential output, this terminator provides noise immunity and signal integrity, making it suitable for high-speed data transmission applications.

Technical Specifications

Data Bus Terminators UCC5672PWPTRG4 attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

YES

Interface IC Type:

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Signal Lines:

9

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Nominal Pull Up Resistance:

105 ohm

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Terminators

Maximum Supply Current:

35 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

UCC5672PWPTRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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