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UC5604Z

Texas Instruments

UC5604Z by Texas Instruments

UC5604Z by Texas Instruments is a SCSI bus terminator with 16 terminals, operating voltage range of 3.8V to 5.25V, and pull-up resistance of 110 ohm. It is ideal for commercial applications requiring bipolar technology, with a compact rectangular package style and zig-zag terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,611 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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7,611

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Digiode

USA . 2,528 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,528

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 990 parts In-Stock

1+ parts

$7.904

100+ parts

-

1k+ parts

$8.460

10k+ parts

-

990

$7.904

-

$8.460

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DigiPath Technology Company

USA . 1,663 parts In-Stock

1+ parts

$8.703

100+ parts

$8.007

1k+ parts

-

10k+ parts

-

1,663

$8.703

$8.007

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ChromeModa Solutions

Germany . 4,114 parts In-Stock

1+ parts

$8.881

100+ parts

$7.282

1k+ parts

-

10k+ parts

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4,114

$8.881

$7.282

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IDEA Electronic Components Group

UK . 1,835 parts In-Stock

1+ parts

$8.881

100+ parts

$8.437

1k+ parts

$7.993

10k+ parts

-

1,835

$8.881

$8.437

$7.993

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AZTECH Wire

Italy . 340 parts In-Stock

1+ parts

$12.992

100+ parts

-

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340

$12.992

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One Stop Electronics

USA . 1,469 parts In-Stock

1+ parts

$29.500

100+ parts

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10k+ parts

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1,469

$29.500

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Corphita

USA . 2,059 parts In-Stock

1+ parts

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2,059

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Overview

Enhance your data bus performance with the UC5604Z by Texas Instruments, a top-quality SCSI bus terminator designed to optimize signal integrity and eliminate reflections. With its advanced technology and reliable construction, this product ensures seamless communication within your system. From industrial automation to telecommunications, the UC5604Z is the go-to solution for enhancing your data transmission efficiency. Trust in Texas Instruments' reputation for excellence and invest in the UC5604Z today to experience unparalleled reliability and performance in your applications.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the terminator, ensuring a longer lifespan.

Maximum Supply Voltage: 5.25 V

Can handle higher voltage inputs, making it versatile for different applications.

Minimum Supply Voltage: 3.8 V

Can operate at lower voltages, ensuring compatibility with a variety of systems.

Maximum Operating Temperature: 70 °C

Suitable for use in environments with higher temperatures, increasing its usability.

Nominal Pull Up Resistance: 110 ohm

Provides the necessary resistance for proper signal termination and noise reduction in the data bus.

Interface IC Type: SCSI BUS TERMINATOR

Specifically designed for SCSI bus systems, ensuring optimal performance and compatibility.

Technical Specifications

Data Bus Terminators UC5604Z attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PZIP-T16

Length:

19.5 mm

No. of Functions:

1

No. of Signal Lines:

9

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

ZIP

Package Equivalence Code:

ZIP16,.11

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Nominal Pull Up Resistance:

110 ohm

Qualification:

Not Qualified

Maximum Seated Height:

7.5 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

4.75 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

ZIG-ZAG

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

2.8 mm

Trade Compliance

UC5604Z Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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