Loading...

SN74F1056SC

Texas Instruments

SN74F1056SC by Texas Instruments

SN74F1056SC by Texas Instruments is a DIODE BUS TERMINATION ARRAY with 8 signal lines. It has 10 terminals in an IN-LINE package style, with a temperature range of 0-70°C. Ideal for data bus termination applications due to its through-hole terminal form and commercial temperature grade.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,079 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,079

-

-

-

-

Digiode

USA . 3,311 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,311

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 846 parts In-Stock

1+ parts

$5.658

100+ parts

-

1k+ parts

-

10k+ parts

-

846

$5.658

-

-

-

Parana Technologies

USA . 833 parts In-Stock

1+ parts

$9.495

100+ parts

-

1k+ parts

$10.100

10k+ parts

-

833

$9.495

-

$10.100

-

ChromeModa Solutions

Germany . 5,902 parts In-Stock

1+ parts

$10.669

100+ parts

$8.749

1k+ parts

-

10k+ parts

-

5,902

$10.669

$8.749

-

-

IDEA Electronic Components Group

UK . 93 parts In-Stock

1+ parts

$10.669

100+ parts

$10.136

1k+ parts

$9.602

10k+ parts

-

93

$10.669

$10.136

$9.602

-

One Stop Electronics

USA . 657 parts In-Stock

1+ parts

$41.500

100+ parts

-

1k+ parts

-

10k+ parts

-

657

$41.500

-

-

-

DigiPath Technology Company

USA . 1,473 parts In-Stock

1+ parts

-

100+ parts

$9.619

1k+ parts

-

10k+ parts

-

1,473

-

$9.619

-

-

Corphita

USA . 1,364 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,364

-

-

-

-

Overview

Enhance the performance of your electronic devices with the SN74F1056SC from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality data bus terminators that ensure seamless signal transmission and optimal system efficiency. Whether you're designing industrial equipment or consumer electronics, this product provides unmatched value and reliability. Say goodbye to signal interference and hello to smooth operation with the SN74F1056SC. Upgrade your projects today and experience the difference Texas Instruments can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the product.

No. of Terminals: 10

Offers flexibility in connecting multiple signal lines, allowing for versatile use in different applications.

Maximum Operating Temperature: 70 °C

Ensures reliable performance even in high-temperature environments, making it suitable for various industrial settings.

Terminal Position: SINGLE

Simplifies the installation process and reduces the risk of errors during setup, enhancing overall efficiency.

Terminal Pitch: 2.54 mm

Facilitates easy connection to other components with standard spacing, promoting compatibility and ease of integration.

Technical Specifications

Data Bus Terminators SN74F1056SC attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PSIP-T10

No. of Functions:

1

No. of Signal Lines:

8

No. of Terminals:

10

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

7.4 mm

Surface Mount:

NO

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

SINGLE

Trade Compliance

SN74F1056SC Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20