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UC5613QP

Texas Instruments

UC5613QP by Texas Instruments

The Texas Instruments UC5613QP is a SCSI bus terminator chip carrier with 28 terminals. It operates b/w 0-70°C, with supply voltage range of 3.8-5.25V and pull-up resistance of 110Ω. Ideal for data bus termination in commercial-grade applications due to its bipolar technology and compact square package design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,660 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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8,660

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Digiode

USA . 3,610 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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3,610

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 704 parts In-Stock

1+ parts

$13.017

100+ parts

-

1k+ parts

$13.514

10k+ parts

-

704

$13.017

-

$13.514

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IDEA Electronic Components Group

UK . 2,171 parts In-Stock

1+ parts

$14.626

100+ parts

$13.895

1k+ parts

$13.163

10k+ parts

-

2,171

$14.626

$13.895

$13.163

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ChromeModa Solutions

Germany . 39 parts In-Stock

1+ parts

$14.626

100+ parts

$11.993

1k+ parts

-

10k+ parts

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39

$14.626

$11.993

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AZTECH Wire

Italy . 253 parts In-Stock

1+ parts

$15.979

100+ parts

-

1k+ parts

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10k+ parts

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253

$15.979

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One Stop Electronics

USA . 1,170 parts In-Stock

1+ parts

$44.500

100+ parts

-

1k+ parts

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1,170

$44.500

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Corphita

USA . 1,807 parts In-Stock

1+ parts

-

100+ parts

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1,807

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DigiPath Technology Company

USA . 1,041 parts In-Stock

1+ parts

-

100+ parts

$13.187

1k+ parts

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10k+ parts

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1,041

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$13.187

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Overview

Upgrade your data bus performance with the Texas Instruments UC5613QP. As a leader in semiconductor manufacturing, Texas Instruments ensures top-quality products that are reliable and efficient. The UC5613QP is a versatile data bus terminator suitable for various applications, providing customers with seamless connectivity and optimized performance. Experience the value and benefits of this innovative product, designed to meet your needs and exceed your expectations. Choose Texas Instruments for superior quality and unmatched reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good durability and protection for the electronic components inside, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy installation and removal, making it convenient for users to work with.

Maximum Supply Voltage: 5.25 V

Can handle higher voltage levels without risk of damage, offering reliability in various operating conditions.

No. of Terminals: 28

Provides multiple connection points for signal lines, offering flexibility in connecting to other components.

Minimum Operating Temperature: 0 °C

Can operate in low-temperature environments without any performance issues, suitable for different working conditions.

Nominal Pull Up Resistance: 110 ohm

Offers the right amount of resistance to maintain signal integrity, ensuring proper communication within the data bus system.

Technology: BIPOLAR

Utilizes bipolar technology for accurate and reliable signal processing, enhancing the overall effectiveness of the data bus terminator.

Interface IC Type: SCSI BUS TERMINATOR

Specifically designed for SCSI bus terminations, ensuring compatibility and optimal performance in SCSI-based systems.

Technical Specifications

Data Bus Terminators UC5613QP attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

S-PQCC-J28

Length:

11.505 mm

No. of Functions:

1

No. of Signal Lines:

9

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Nominal Pull Up Resistance:

110 ohm

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

4.75 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

11.505 mm

Trade Compliance

UC5613QP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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