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SN74S1051DRE4

Texas Instruments

SN74S1051DRE4 by Texas Instruments

SN74S1051DRE4 by Texas Instruments is a 16-terminal data bus terminator with a small outline package. It operates b/w 0-70°C, has a supply voltage of 5V, and features nickel palladium gold terminal finish. Ideal for diode bus termination arrays in commercial-grade applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,986 parts In-Stock

1+ parts

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6,986

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Digiode

USA . 4,718 parts In-Stock

1+ parts

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4,718

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 166 parts In-Stock

1+ parts

$6.039

100+ parts

-

1k+ parts

$6.817

10k+ parts

-

166

$6.039

-

$6.817

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ChromeModa Solutions

Germany . 5,885 parts In-Stock

1+ parts

$6.785

100+ parts

$5.564

1k+ parts

-

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5,885

$6.785

$5.564

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IDEA Electronic Components Group

UK . 1,990 parts In-Stock

1+ parts

$6.785

100+ parts

-

1k+ parts

$6.106

10k+ parts

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1,990

$6.785

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$6.106

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AZTECH Wire

Italy . 292 parts In-Stock

1+ parts

$19.635

100+ parts

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292

$19.635

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One Stop Electronics

USA . 515 parts In-Stock

1+ parts

$36.500

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515

$36.500

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Corphita

USA . 3,128 parts In-Stock

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3,128

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DigiPath Technology Company

USA . 330 parts In-Stock

1+ parts

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100+ parts

$6.117

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330

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$6.117

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Overview

Enhance the performance and reliability of your data bus systems with the SN74S1051DRE4 from Texas Instruments. Known for their superior quality and expertise in semiconductor manufacturing, Texas Instruments delivers cutting-edge solutions for a wide range of applications. The SN74S1051DRE4 is a versatile data bus terminator that ensures seamless communication between devices, offering unmatched value and benefits to customers seeking efficient and robust data transmission. Upgrade your systems today with this innovative product and experience enhanced connectivity like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and reliability for long-term use.

Surface Mount: YES

Surface mount capability allows for easy installation and space-saving on PCBs.

No. of Terminals: 16

Having 16 terminals allows for multiple connections, making it versatile for different applications.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this product can withstand heat and perform efficiently in various environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel, palladium, and gold terminal finish ensures good conductivity and corrosion resistance.

Width: 3.9 mm

Compact width size enables the product to be used in tight spaces or densely populated PCB layouts.

Length: 9.9 mm

The length of 9.9mm is suitable for accommodating multiple terminals and signal lines.

Nominal Supply Voltage: 5 V

Having a nominal supply voltage of 5V makes it compatible with a wide range of systems and devices.

Technical Specifications

Data Bus Terminators SN74S1051DRE4 attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Signal Lines:

12

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

SN74S1051DRE4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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