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UCC5630AMWPR/81535

Texas Instruments

UCC5630AMWPR/81535 by Texas Instruments

UCC5630AMWPR/81535 by Texas Instruments is a SCSI bus terminator with 36 terminals, operating at 2.7-5.25V and -40 to 85°C. It features differential outputs, 105 ohm pull-up resistance, and is surface-mountable for compact designs in data communication systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,822 parts In-Stock

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8,822

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Digiode

USA . 3,851 parts In-Stock

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3,851

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,133 parts In-Stock

1+ parts

$8.182

100+ parts

-

1k+ parts

$8.792

10k+ parts

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1,133

$8.182

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$8.792

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IDEA Electronic Components Group

UK . 863 parts In-Stock

1+ parts

$9.193

100+ parts

$8.733

1k+ parts

$8.274

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863

$9.193

$8.733

$8.274

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ChromeModa Solutions

Germany . 208 parts In-Stock

1+ parts

$9.193

100+ parts

$7.538

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208

$9.193

$7.538

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AZTECH Wire

Italy . 343 parts In-Stock

1+ parts

$10.850

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343

$10.850

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One Stop Electronics

USA . 1,060 parts In-Stock

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$21.500

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1,060

$21.500

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Corphita

USA . 4,439 parts In-Stock

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4,439

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DigiPath Technology Company

USA . 2,217 parts In-Stock

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$8.288

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2,217

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$8.288

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Overview

Elevate your data bus termination with the UCC5630AMWPR/81535 by Texas Instruments. Crafted with precision and quality, this small outline, shrink pitch package offers a seamless integration into your system. Perfect for SCSI applications, this terminator ensures reliable signal transmission and optimal performance. Trust in Texas Instruments' expertise to deliver the value and benefits you need for your next project. Don't settle for less when you can have the best with the UCC5630AMWPR/81535.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for high-performance applications.

Surface Mount: YES

Surface mount feature allows for easy installation and space-saving design in electronic circuits.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage tolerance ensures compatibility with a wide range of systems and voltages.

No. of Terminals: 36

Having 36 terminals allows for a high level of connectivity and compatibility with various devices and systems.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this product can withstand elevated temperatures without performance degradation.

Differential Output: YES

Differential output ensures reliable signal transmission and noise immunity, making this product suitable for critical data bus applications.

Nominal Pull Up Resistance: 105 ohm

The nominal pull-up resistance value provides optimal signal integrity and performance in data transfer processes.

Technical Specifications

Data Bus Terminators UCC5630AMWPR/81535 attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

YES

Interface IC Type:

JESD-30 Code:

R-PDSO-G36

Length:

15.385 mm

No. of Functions:

1

No. of Signal Lines:

9

No. of Terminals:

36

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Nominal Pull Up Resistance:

105 ohm

Qualification:

Not Qualified

Maximum Seated Height:

2.64 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

UCC5630AMWPR/81535 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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