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NUF2015W1T2

Onsemi

NUF2015W1T2 by Onsemi

NUF2015W1T2 by Onsemi is a Data Bus Terminator with 6 terminals, operating at 3.3V. It has a MILITARY temperature grade, -55 to 125 °C range, and 1500 ohm pull up resistance. Ideal for interface ICs requiring dual terminal position and GULL WING form in compact design applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,456 parts In-Stock

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2,456

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Vyrian

USA . 354 parts In-Stock

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354

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Kulean Microsystems

USA . 7,058 parts In-Stock

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7,058

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TANS Electronics

Latvia . 6,772 parts In-Stock

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6,772

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SupplyDigital Components

Austria . 4,839 parts In-Stock

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4,839

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Corphita

USA . 2,163 parts In-Stock

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Problanco Electronics

Mexico . 985 parts In-Stock

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985

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UHIMA Technologies

Türkiye . 414 parts In-Stock

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414

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Corohmni

South Africa . 305 parts In-Stock

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Overview

Enhance your data bus systems with the NUF2015W1T2 by Onsemi, a top-quality terminator that ensures reliable signal transmission. Manufactured by industry leader Onsemi, this product offers exceptional performance and durability for a wide range of applications. From automotive to industrial settings, this compact and versatile terminator guarantees seamless communication between devices. Trust in the superior quality and precision engineering of Onsemi to elevate your data bus networks to new heights. Choose the NUF2015W1T2 for unmatched value and efficiency in your connectivity solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the product lightweight and durable, suitable for a variety of applications.

Surface Mount: YES

Surface mount capability allows for easy installation and saves space on a circuit board.

Power Supplies (V): 3.3

Operates on a low power supply voltage of 3.3V, making it energy efficient.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures up to 125 °C, suitable for harsh operating environments.

Nominal Pull Up Resistance: 1500 ohm

Provides a stable pull-up resistance of 1500 ohms, ensuring reliable performance.

No. of Signal Lines: 2

Supports 2 signal lines, allowing for versatile connection options.

Terminal Pitch: 0.65 mm

Terminal pitch of 0.65mm allows for precise connections and space-saving design.

Interface IC Type: OTHER TERMINATOR

Compatible with various interface IC types, making it a versatile choice for different applications.

Technical Specifications

Data Bus Terminators NUF2015W1T2 attributes and parameters. Explore more Data Bus Terminators devices from Onsemi

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Length:

2 mm

No. of Functions:

1

No. of Signal Lines:

2

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3.3

Nominal Pull Up Resistance:

1500 ohm

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Terminators

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

NUF2015W1T2 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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