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UC5607DWP

Texas Instruments

UC5607DWP by Texas Instruments

UC5607DWP by Texas Instruments is a SCSI bus terminator with 18 signal lines. It operates b/w 0-70°C, with supply voltage range of 3.8-5.25V. This small outline package has 28 terminals and Gull Wing terminal form, ideal for data bus termination applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,628 parts In-Stock

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Vyrian

USA . 1,910 parts In-Stock

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1,910

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Distributors (Availability)

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Parana Technologies

USA . 1,491 parts In-Stock

1+ parts

$11.721

100+ parts

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$12.116

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1,491

$11.721

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$12.116

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DigiPath Technology Company

USA . 2,295 parts In-Stock

1+ parts

$12.907

100+ parts

$11.874

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2,295

$12.907

$11.874

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ChromeModa Solutions

Germany . 1,444 parts In-Stock

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$13.170

100+ parts

$10.799

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1,444

$13.170

$10.799

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IDEA Electronic Components Group

UK . 292 parts In-Stock

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$13.170

100+ parts

$12.512

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$11.853

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292

$13.170

$12.512

$11.853

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AZTECH Wire

Italy . 578 parts In-Stock

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$18.215

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578

$18.215

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One Stop Electronics

USA . 876 parts In-Stock

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$46.500

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Corphita

USA . 4,922 parts In-Stock

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Kepictronics

USA . 3,953 parts In-Stock

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Overview

Enhance the performance of your data bus systems with the UC5607DWP by Texas Instruments. Crafted with precision and quality, this SCSI bus terminator offers unparalleled reliability and efficiency in managing signal lines. Its sleek small outline package design and dual terminal position make it suitable for a range of applications, ensuring seamless operation at temperatures between 0 to 70°C. Trust in Texas Instruments' expertise in technology and innovation to optimize your system's performance. Choose the UC5607DWP for superior quality and value-added benefits that will elevate your data bus solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability to the product, ensuring it can withstand harsh environmental conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 5.25 V

With a high maximum supply voltage, this product can handle fluctuations in power supply without risking damage, ensuring stable operation.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on the circuit board, making it ideal for compact designs.

Power Supplies (V): 5

Operating at a standard 5V power supply, this product is compatible with a wide range of electronic systems.

No. of Terminals: 28

With a high number of terminals, this product provides ample connectivity options for various signal lines, enabling versatile applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, making it suitable for compact electronic devices.

Minimum Supply Voltage: 3.8 V

The low minimum supply voltage ensures that the product can operate efficiently even in situations where power supply levels are lower than standard.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this product can perform reliably in elevated temperature environments without risk of overheating.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures ensures the product can function effectively in various operating conditions.

Terminal Position: DUAL

Dual terminal position offers flexibility in connecting and routing signal lines, enhancing the adaptability of the product in different circuit layouts.

Maximum Seated Height: 2.64 mm

The low maximum seated height allows for a compact design, making it suitable for applications where space is a constraint.

Width: 7.5 mm

The narrow width of the product enables efficient utilization of space on the circuit board, contributing to overall system compactness.

Length: 17.905 mm

The moderate length of the product provides a balanced form factor, suitable for various electronic devices without compromising on space constraints.

Temperature Grade: COMMERCIAL

Designed for commercial use, this product meets industry standards for temperature tolerance and reliability in mainstream applications.

Nominal Pull Up Resistance: 110 ohm

With a specified nominal pull-up resistance, this product helps maintain signal integrity and stability in data transmission lines.

Technology: BIPOLAR

Utilizing bipolar technology ensures high-speed signal processing and compatibility with a wide range of electronic systems.

Terminal Form: GULL WING

The gull-wing terminal form facilitates easy soldering and provides mechanical strength to the connections, enhancing the product's durability.

No. of Signal Lines: 18

Offering support for 18 signal lines, this product is suitable for applications requiring multiple data channels, such as high-speed data transfer.

Nominal Supply Voltage: 4.75 V

Operating at a nominal supply voltage of 4.75V ensures compatibility with standard power sources while providing a stable operating range for the product.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27mm allows for precise connection and alignment of terminals, ensuring reliable signal transmission within the circuit.

Interface IC Type: SCSI BUS TERMINATOR

Designed as a SCSI bus terminator, this product is specialized for SCSI interface applications, offering optimized performance and compatibility in SCSI systems.

Technical Specifications

Data Bus Terminators UC5607DWP attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PDSO-G28

Length:

17.905 mm

No. of Functions:

1

No. of Signal Lines:

18

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Nominal Pull Up Resistance:

110 ohm

Qualification:

Not Qualified

Maximum Seated Height:

2.64 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

4.75 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

UC5607DWP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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