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UCC5638FQPTRG4

Texas Instruments

UCC5638FQPTRG4 by Texas Instruments

UCC5638FQPTRG4 by Texas Instruments is a Data Bus Terminator with 48 terminals, operating at 3.3V and supporting differential output. It features a low profile flatpack package style, nickel palladium gold terminal finish, and quad terminal position. Ideal for SCSI bus termination applications due to its commercial temperature grade and 105 ohm nominal pull-up resistance.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,756 parts In-Stock

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6,756

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Digiode

USA . 1,995 parts In-Stock

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1,995

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Semi Source

USA . 1,075 parts In-Stock

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1,075

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ComSIT Distribution GmbH

Germany . 1,000 parts In-Stock

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ComSIT USA

USA . 1,000 parts In-Stock

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Cyclops Electronics Ltd

UK . 800 parts In-Stock

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800

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One Stop Electronics

USA . 148 parts In-Stock

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$1.500

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$1.500

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AZTECH Wire

Italy . 592 parts In-Stock

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$6.883

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592

$6.883

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Parana Technologies

USA . 729 parts In-Stock

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$7.998

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$8.577

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DigiPath Technology Company

USA . 964 parts In-Stock

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$8.807

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$8.103

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964

$8.807

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ChromeModa Solutions

Germany . 2,143 parts In-Stock

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$8.987

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$7.369

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$8.987

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IDEA Electronic Components Group

UK . 219 parts In-Stock

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$8.987

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$8.538

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$8.088

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219

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$8.088

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Component Stockers USA

USA . 791 parts In-Stock

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$99.990

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Authorized Procurement Solutions

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Kepictronics

USA . 800 parts In-Stock

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800

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Microchip USA

USA . 454 parts In-Stock

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454

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Corphita

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190

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Overview

Enhance your data bus performance with the UCC5638FQPTRG4 by Texas Instruments, a top-tier manufacturer renowned for cutting-edge technology. Ideal for SCSI bus terminators, this product offers superior quality and reliability. Its compact design and low profile package make it easy to integrate into your system. With a nominal pull-up resistance of 105 ohms and differential output, you can expect optimized signal transmission. Experience seamless operation in commercial-grade applications with this high-performing solution. Elevate your data bus efficiency with Texas Instruments' UCC5638FQPTRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 5.25 V

Supports a wide range of supply voltages for compatibility with different systems.

Package Shape: SQUARE

Square shape helps in easy placement and alignment on the PCB.

Power Supplies (V): 3.3

Operates efficiently at a standard power supply voltage of 3.3V.

No. of Terminals: 48

Having 48 terminals allows for multiple connections and signals to be processed.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style offers a compact design for space-saving and enhanced signal transmission.

Minimum Supply Voltage: 2.7 V

Works at low supply voltage levels, ensuring energy efficiency.

Maximum Operating Temperature: 70 °C

Can operate at high temperatures without any performance issues.

Minimum Operating Temperature: 0 °C

Capable of functioning in cold environments as well.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance for reliable signal transmission.

Terminal Position: QUAD

Quad terminal position allows for efficient connections and signal routing.

Maximum Seated Height: 1.6 mm

Low seated height for compact and space-efficient PCB design.

Width: 7 mm

Optimal width for easy integration into circuit layouts.

Differential Output: YES

Supports differential signaling for improved noise immunity and signal integrity.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for efficient soldering and reflow processes during manufacturing.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures for reliable solder joints.

Length: 7 mm

Compact length for space-saving PCB layouts.

Temperature Grade: COMMERCIAL

Suitable for commercial applications with standard temperature requirements.

Nominal Pull Up Resistance: 105 ohm

Optimal pull-up resistance for stable signal levels and data transmission.

Technology: BICMOS

Utilizes BiCMOS technology for a combination of high-speed CMOS and low-power bipolar transistors.

Terminal Form: GULL WING

Gull wing terminals are robust and aid in easy surface mounting on PCBs.

No. of Signal Lines: 15

Supports multiple signal lines for versatile connectivity options.

Maximum Supply Current: 25 mA

Operates efficiently with a maximum supply current of 25mA.

Nominal Supply Voltage: 3.3 V

Stable operation at a nominal supply voltage of 3.3V.

Terminal Pitch: 0.5 mm

Fine terminal pitch for precise connections and signal routing.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates moderate sensitivity to moisture during storage and handling.

Interface IC Type: SCSI BUS TERMINATOR

Designed specifically for SCSI bus termination applications for optimal performance.

Technical Specifications

Data Bus Terminators UCC5638FQPTRG4 attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

YES

Interface IC Type:

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Signal Lines:

15

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Nominal Pull Up Resistance:

105 ohm

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Bus Terminators

Maximum Supply Current:

25 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

UCC5638FQPTRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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