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UC5609J

Texas Instruments

UC5609J by Texas Instruments

UC5609J by Texas Instruments is a SCSI bus terminator with 18 signal lines. It operates b/w 0-70°C, with supply voltage range of 3.8-5.25V and pull-up resistance of 110Ω. Ideal for commercial applications requiring bipolar technology in an inline package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,648 parts In-Stock

1+ parts

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6,648

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Digiode

USA . 3,585 parts In-Stock

1+ parts

-

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3,585

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 768 parts In-Stock

1+ parts

$6.342

100+ parts

-

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768

$6.342

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Parana Technologies

USA . 1,225 parts In-Stock

1+ parts

$7.067

100+ parts

-

1k+ parts

$7.601

10k+ parts

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1,225

$7.067

-

$7.601

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DigiPath Technology Company

USA . 479 parts In-Stock

1+ parts

$7.781

100+ parts

$7.159

1k+ parts

-

10k+ parts

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479

$7.781

$7.159

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ChromeModa Solutions

Germany . 2,563 parts In-Stock

1+ parts

$7.940

100+ parts

$6.511

1k+ parts

-

10k+ parts

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2,563

$7.940

$6.511

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IDEA Electronic Components Group

UK . 1,092 parts In-Stock

1+ parts

$7.940

100+ parts

-

1k+ parts

$7.146

10k+ parts

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1,092

$7.940

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$7.146

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One Stop Electronics

USA . 941 parts In-Stock

1+ parts

$22.500

100+ parts

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941

$22.500

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Corphita

USA . 2,909 parts In-Stock

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2,909

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Overview

Unlock the power of seamless data transmission with the UC5609J by Texas Instruments. Designed with precision and reliability in mind, this SCSI bus terminator offers unparalleled quality and performance for your electronic applications. From ensuring signal integrity to maximizing efficiency, this product guarantees smooth communication across 18 signal lines. Trust in Texas Instruments to deliver cutting-edge technology that meets your needs every time. Elevate your projects with the UC5609J and experience the difference today.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection, ensuring the product will last long in various environments.

Maximum Supply Voltage: 5.25 V

Supports a wide range of supply voltages, making it versatile and compatible with different systems.

Package Shape: RECTANGULAR

Compact shape allows for efficient use of space in systems with limited room for components.

No. of Terminals: 24

Having a high number of terminals allows for connectivity with multiple devices, enhancing the product's versatility.

Minimum Operating Temperature: 0 °C

Capable of operating at low temperatures ensures reliability even in harsh environmental conditions.

Nominal Pull Up Resistance: 110 ohm

Provides the required resistance for proper signal termination, ensuring optimal performance in data transfer.

Interface IC Type: SCSI BUS TERMINATOR

Designed specifically for SCSI bus termination, ensuring compatibility and efficient data transfer in SCSI systems.

Technical Specifications

Data Bus Terminators UC5609J attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-GDIP-T24

Length:

30.985 mm

No. of Functions:

1

No. of Signal Lines:

18

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Nominal Pull Up Resistance:

110 ohm

Qualification:

Not Qualified

Maximum Seated Height:

5.72 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

4.75 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

15.24 mm

Trade Compliance

UC5609J Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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