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UCC5646PMTR

Texas Instruments

UCC5646PMTR by Texas Instruments

UCC5646PMTR by Texas Instruments is a Data Bus Terminator with 64 terminals, operating at 2.7-5.25V. It features BICMOS technology, quad terminal position, and SCSI interface type. Ideal for applications requiring low-profile, fine-pitch package style in commercial temperature range up to 70°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,955 parts In-Stock

1+ parts

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8,955

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Digiode

USA . 2,490 parts In-Stock

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2,490

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,971 parts In-Stock

1+ parts

$2.545

100+ parts

-

1k+ parts

$3.032

10k+ parts

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1,971

$2.545

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$3.032

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ChromeModa Solutions

Germany . 4,503 parts In-Stock

1+ parts

$2.859

100+ parts

$2.344

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4,503

$2.859

$2.344

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IDEA Electronic Components Group

UK . 2,137 parts In-Stock

1+ parts

$2.859

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$2.573

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2,137

$2.859

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$2.573

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AZTECH Wire

Italy . 731 parts In-Stock

1+ parts

$8.998

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731

$8.998

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One Stop Electronics

USA . 1,636 parts In-Stock

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$43.500

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1,636

$43.500

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Corphita

USA . 2,046 parts In-Stock

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2,046

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DigiPath Technology Company

USA . 1,065 parts In-Stock

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$2.578

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1,065

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$2.578

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Overview

Enhance your data bus systems with the top-quality UCC5646PMTR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures reliability and durability in every product they create. The UCC5646PMTR is a must-have for applications requiring precise termination of signal lines, offering unmatched performance and efficiency. Trust in Texas Instruments to deliver cutting-edge solutions that provide value and benefits to customers, setting new standards in the field of data bus terminators.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product durable and resistant to damage, ensuring a long lifespan.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on PCBs, saving space and simplifying assembly.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage of 5.25 V ensures compatibility with a wide range of systems and applications.

Package Shape: SQUARE

The square package shape makes it easy to integrate into circuit layouts and provides a consistent form factor for standardized designs.

Power Supplies (V): 3/5

Support for multiple power supply options (3V and 5V) allows flexibility in meeting various system requirements.

No. of Terminals: 64

With 64 terminals, this product can accommodate a high number of connections, making it suitable for complex data bus systems.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style offers space-saving benefits and enables high-density mounting in compact devices.

Minimum Supply Voltage: 2.7 V

The low minimum supply voltage of 2.7 V ensures reliable operation even in low power scenarios, enhancing the product's versatility.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can withstand high heat environments, improving its overall durability.

Minimum Operating Temperature: 0 °C

The product's ability to operate at temperatures as low as 0°C ensures reliable performance in various environmental conditions.

Terminal Position: QUAD

The quad terminal position simplifies the connection process and helps in ensuring proper alignment during installation.

Maximum Seated Height: 1.6 mm

The low maximum seated height of 1.6 mm allows for a slim profile and reduces the overall footprint of the product in the system design.

Width: 10 mm

The compact width of 10 mm makes the product suitable for applications where space is limited, without compromising on functionality.

Differential Output: YES

Differential output helps in reducing signal interference and noise, ensuring reliable and high-quality data transmission.

Length: 10 mm

The compact length of 10 mm contributes to the overall space-saving design of the product, making it ideal for crowded PCB layouts.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates that the product is suitable for standard operating conditions, making it widely compatible.

Nominal Pull Up Resistance: 105 ohm

The nominal pull up resistance of 105 ohm helps in maintaining signal integrity and stability in data transmission processes.

Technology: BICMOS

The use of BiCMOS technology combines the advantages of both bipolar and CMOS technologies, offering improved performance and efficiency.

Terminal Form: GULL WING

The gull-wing terminal form provides secure soldering connections and facilitates easier inspection during manufacturing and maintenance.

No. of Signal Lines: 27

With 27 signal lines, this product can support a substantial amount of data transfer, making it suitable for high-speed communication systems.

Terminal Pitch: 0.5 mm

The narrow terminal pitch of 0.5 mm allows for high-density packaging and precise alignment of the terminals, enhancing reliability.

Interface IC Type: SCSI BUS TERMINATOR

Compatibility with SCSI Bus Terminator interface IC type ensures seamless integration with SCSI bus systems, making it a reliable choice for such applications.

Technical Specifications

Data Bus Terminators UCC5646PMTR attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

YES

Interface IC Type:

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of Functions:

1

No. of Signal Lines:

27

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5

Nominal Pull Up Resistance:

105 ohm

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

2.7 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Trade Compliance

UCC5646PMTR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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