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UCC5631AFQPTRG4

Texas Instruments

UCC5631AFQPTRG4 by Texas Instruments

UCC5631AFQPTRG4 by Texas Instruments is a Data Bus Terminator with 48 terminals, operating at 3.3V nominal voltage and supporting SCSI interface. It features a max supply voltage of 5.25V, differential output, and operates in commercial temperature grade up to 70°C. Ideal for applications requiring fine pitch flatpack terminators in electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,820 parts In-Stock

1+ parts

-

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9,820

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Digiode

USA . 3,957 parts In-Stock

1+ parts

-

100+ parts

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3,957

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 900 parts In-Stock

1+ parts

$0.500

100+ parts

-

1k+ parts

-

10k+ parts

-

900

$0.500

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-

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Parana Technologies

USA . 1,935 parts In-Stock

1+ parts

$9.855

100+ parts

$915.183

1k+ parts

$8.869

10k+ parts

-

1,935

$9.855

$915.183

$8.869

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DigiPath Technology Company

USA . 1,711 parts In-Stock

1+ parts

$10.852

100+ parts

$9.983

1k+ parts

-

10k+ parts

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1,711

$10.852

$9.983

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ChromeModa Solutions

Germany . 1,181 parts In-Stock

1+ parts

$11.073

100+ parts

$9.080

1k+ parts

-

10k+ parts

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1,181

$11.073

$9.080

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IDEA Electronic Components Group

UK . 997 parts In-Stock

1+ parts

$11.073

100+ parts

$10.519

1k+ parts

$9.966

10k+ parts

-

997

$11.073

$10.519

$9.966

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AZTECH Wire

Italy . 848 parts In-Stock

1+ parts

$12.445

100+ parts

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848

$12.445

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Corphita

USA . 511 parts In-Stock

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511

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Overview

Enhance your data bus systems with the UCC5631AFQPTRG4 by Texas Instruments. Renowned for their top-quality electronic components, Texas Instruments delivers reliability and innovation with every product. The UCC5631AFQPTRG4 is a versatile SCSI bus terminator that offers seamless integration, superior performance, and maximum efficiency. Whether you're in the IT industry or working on networking projects, this cutting-edge device provides the ultimate solution for your data bus termination needs. Upgrade to Texas Instruments and experience unparalleled value and functionality!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring long-lasting performance.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 5.25 V

Can handle a higher supply voltage, making it suitable for a wide range of applications.

No. of Terminals: 48

Offers a sufficient number of terminals for connecting various components and peripherals in a system.

Differential Output: YES

Enables accurate data transmission over long distances and reduces signal interference.

Temperature Grade: COMMERCIAL

Designed for use in standard commercial environments, ensuring reliable operation under normal conditions.

Technical Specifications

Data Bus Terminators UCC5631AFQPTRG4 attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

YES

Interface IC Type:

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of Functions:

1

No. of Signal Lines:

9

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5

Nominal Pull Up Resistance:

105 ohm

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Trade Compliance

UCC5631AFQPTRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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