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SN74S1053PWE4

Texas Instruments

SN74S1053PWE4 by Texas Instruments

SN74S1053PWE4 by Texas Instruments is a Data Bus Terminator with 16 signal lines and 20 terminals. It operates at temperatures b/w 0-70°C, with a supply voltage of 5V. This IC type is used for diode bus termination arrays in various electronic applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,508 parts In-Stock

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8,508

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Digiode

USA . 1,984 parts In-Stock

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1,984

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Nova Conductors

Japan . 870 parts In-Stock

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870

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Semi Source

USA . 35 parts In-Stock

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35

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,876 parts In-Stock

1+ parts

$3.793

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$4.283

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1,876

$3.793

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$4.283

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ChromeModa Solutions

Germany . 3,007 parts In-Stock

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$4.262

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$3.495

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3,007

$4.262

$3.495

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IDEA Electronic Components Group

UK . 2,149 parts In-Stock

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$4.262

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$3.836

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2,149

$4.262

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$3.836

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AZTECH Wire

Italy . 645 parts In-Stock

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$11.125

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645

$11.125

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One Stop Electronics

USA . 416 parts In-Stock

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$13.500

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416

$13.500

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Ampacity Inc.

Singapore . 889 parts In-Stock

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$42.500

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889

$42.500

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Corphita

USA . 4,021 parts In-Stock

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4,021

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DigiPath Technology Company

USA . 2,367 parts In-Stock

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$3.843

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$3.843

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Aranea Global

USA . 2,000 parts In-Stock

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Overview

Elevate your data bus systems with the SN74S1053PWE4 by Texas Instruments. Built with precision and quality, this diode bus termination array offers unparalleled reliability and performance. Whether you're in the automotive, industrial, or telecommunications industry, this product is designed to meet your needs. With a small outline and dual terminal position, this device provides seamless integration and efficient operation. Trust in Texas Instruments to deliver cutting-edge technology that enhances your systems and maximizes productivity. Upgrade to the SN74S1053PWE4 today and experience the difference in your applications.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

The surface mount feature allows for easy installation on PCBs, saving space and reducing assembly time.

No. of Terminals: 20

Having 20 terminals allows for a sufficient number of connections for data bus termination.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures the product can withstand varying environmental conditions.

Width: 4.4 mm

The compact width of 4.4 mm enables the data bus terminator to fit in tight spaces on a PCB.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature of 30 seconds prevents overheating during soldering, ensuring product reliability.

No. of Signal Lines: 16

With 16 signal lines, the data bus terminator can effectively manage and terminate multiple data lines for optimal performance.

Technical Specifications

Data Bus Terminators SN74S1053PWE4 attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Signal Lines:

16

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

SN74S1053PWE4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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