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SN74F1056DRE4

Texas Instruments

SN74F1056DRE4 by Texas Instruments

SN74F1056DRE4 by Texas Instruments is a Data Bus Terminator with 16 terminals in a small outline package. It operates b/w 0-70°C, with peak reflow temperature of 260°C for 30s. Ideal for diode bus termination arrays in commercial-grade applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,599 parts In-Stock

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7,599

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Digiode

USA . 923 parts In-Stock

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923

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 473 parts In-Stock

1+ parts

$9.323

100+ parts

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473

$9.323

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Parana Technologies

USA . 2,009 parts In-Stock

1+ parts

$13.070

100+ parts

-

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$13.564

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2,009

$13.070

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$13.564

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DigiPath Technology Company

USA . 2,198 parts In-Stock

1+ parts

$14.391

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2,198

$14.391

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IDEA Electronic Components Group

UK . 1,464 parts In-Stock

1+ parts

$14.685

100+ parts

$13.951

1k+ parts

$13.216

10k+ parts

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1,464

$14.685

$13.951

$13.216

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ChromeModa Solutions

Germany . 1,339 parts In-Stock

1+ parts

$14.685

100+ parts

$12.042

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1,339

$14.685

$12.042

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One Stop Electronics

USA . 217 parts In-Stock

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$19.500

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217

$19.500

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Corphita

USA . 4,170 parts In-Stock

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4,170

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Overview

Upgrade your data bus termination with the SN74F1056DRE4 by Texas Instruments, a high-quality solution designed for optimal performance and reliability. Manufactured by industry leader Texas Instruments, this product offers unmatched value and benefits for a wide range of applications. With its innovative design and durable construction, this small outline package ensures seamless integration and ease of use. Experience superior quality and efficiency with the SN74F1056DRE4, setting new standards in data bus terminators.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a lightweight and durable housing for the terminator, making it suitable for a variety of applications.

Surface Mount: YES

Allows for easy and secure mounting on a PCB, saving space and making assembly more efficient.

No. of Terminals: 16

Provides ample connection points for interfacing with multiple devices or components.

Maximum Operating Temperature: 70 °C

Ensures that the terminator can withstand high operating temperatures without compromising performance.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish offers excellent conductivity and corrosion resistance, ensuring reliable signal transmission.

Width: 3.9 mm

Compact width allows for efficient use of space on the PCB and easy integration into existing designs.

Interface IC Type: DIODE BUS TERMINATION ARRAY

The diode bus termination array helps to provide signal integrity and prevent signal reflections, ensuring smooth data transmission.

Technical Specifications

Data Bus Terminators SN74F1056DRE4 attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Signal Lines:

8

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

SN74F1056DRE4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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