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IP4772CZ16,118

NXP Semiconductors

IP4772CZ16,118 by NXP Semiconductors

DIODE BUS TERMINATION ARRAY; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR;

Median Price

$1.151

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 395,224 parts In-Stock

1+ parts

-

100+ parts

$1.130

1k+ parts

$0.938

10k+ parts

$0.836

395,224

-

$1.130

$0.938

$0.836

Verical

USA . 395,224 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.172

10k+ parts

$1.045

395,224

-

-

$1.172

$1.045

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,310 parts In-Stock

1+ parts

$0.453

100+ parts

-

1k+ parts

-

10k+ parts

-

4,310

$0.453

-

-

-

Vyrian

USA . 4,642 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,642

-

-

-

-

Anansix

USA . 2,239 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,239

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,439 parts In-Stock

1+ parts

$0.429

100+ parts

-

1k+ parts

-

10k+ parts

-

3,439

$0.429

-

-

-

Microchip USA

USA . 288 parts In-Stock

1+ parts

$2.097

100+ parts

-

1k+ parts

-

10k+ parts

-

288

$2.097

-

-

-

Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$5.688

100+ parts

$5.176

1k+ parts

$4.664

10k+ parts

-

2,500

$5.688

$5.176

$4.664

-

AZTECH Wire

Italy . 1,166 parts In-Stock

1+ parts

$8.020

100+ parts

-

1k+ parts

-

10k+ parts

-

1,166

$8.020

-

-

-

UNI Independent Distributors

Spain . 2,134 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,134

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Perfect Parts

USA . 244 parts In-Stock

1+ parts

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244

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GreenTree Electronics

Israel . 218 parts In-Stock

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218

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Authorized Procurement Solutions

USA . 218 parts In-Stock

1+ parts

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100+ parts

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218

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Technical Specifications

Data Bus Terminators IP4772CZ16,118 attributes and parameters. Explore more Data Bus Terminators devices from NXP Semiconductors

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Signal Lines:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.73 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

IP4772CZ16,118 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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