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TVP3026-135AMDN

Texas Instruments

TVP3026-135AMDN by Texas Instruments

TVP3026-135AMDN by Texas Instruments is a Display Controller with 1280x1024 resolution, 8-bit data bus, and 14.31818 MHz clock frequency. It is used in commercial applications for driving displays with a max supply voltage of 5.25V and operating temperature range of 0-70°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,017 parts In-Stock

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6,017

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Digiode

USA . 1,348 parts In-Stock

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1,348

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,270 parts In-Stock

1+ parts

$6.000

100+ parts

-

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1,270

$6.000

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AZTECH Wire

Italy . 447 parts In-Stock

1+ parts

$12.722

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447

$12.722

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Parana Technologies

USA . 1,786 parts In-Stock

1+ parts

$24.339

100+ parts

$2,260.230

1k+ parts

$21.905

10k+ parts

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1,786

$24.339

$2,260.230

$21.905

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DigiPath Technology Company

USA . 202 parts In-Stock

1+ parts

$26.800

100+ parts

$24.656

1k+ parts

-

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202

$26.800

$24.656

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ChromeModa Solutions

Germany . 5,232 parts In-Stock

1+ parts

$27.347

100+ parts

$22.425

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5,232

$27.347

$22.425

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IDEA Electronic Components Group

UK . 2,308 parts In-Stock

1+ parts

$27.347

100+ parts

$25.980

1k+ parts

$24.612

10k+ parts

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2,308

$27.347

$25.980

$24.612

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Corohmni

South Africa . 1,093 parts In-Stock

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$34.857

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1,093

$34.857

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Corphita

USA . 3,648 parts In-Stock

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3,648

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Overview

Experience superior display control with the TVP3026-135AMDN by Texas Instruments. Known for their exceptional quality and innovation, Texas Instruments delivers cutting-edge solutions for all your display controller needs. Whether you're in the gaming industry, medical field, or digital signage sector, this versatile product offers unmatched performance and reliability. With a wide range of applications and advanced features, the TVP3026-135AMDN provides value, benefits, and advantages that will elevate your projects to the next level. Trust Texas Instruments to deliver excellence in every aspect of display technology.

Feature Benefit Bullets

Package Body Material: METAL

Metal package body provides durability and physical protection to the internal components of the display controller, ensuring longevity and reliability in various conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration of the display controller onto circuit boards, saving space and enhancing assembly process.

Maximum Supply Voltage: 5.25 V

Higher maximum supply voltage tolerance provides flexibility in power input options and can accommodate variations in power sources without risk of damage to the display controller.

Address Bus Width: 4

With a wider address bus width, the display controller can support more complex data processing tasks and handle larger amounts of data efficiently, enhancing overall performance.

Package Shape: SQUARE

Square package shape allows for uniform and compact placement of the display controller on circuit boards, optimizing space utilization and facilitating neat and organized design layouts.

No. of Terminals: 160

Having a higher number of terminals provides greater connectivity options and versatility for interfacing with other components, making the display controller compatible with a wide range of systems and applications.

Package Style (Meter): FLATPACK

Flatpack package style offers convenient mounting options and efficient heat dissipation, promoting better thermal management and reliability in operation.

Minimum Supply Voltage: 4.75 V

Lower minimum supply voltage ensures compatibility with various power sources and helps in preventing under-voltage issues that could affect the performance of the display controller.

Maximum Operating Temperature: 70 °C

High maximum operating temperature range allows the display controller to function reliably in demanding environmental conditions without risk of overheating or performance degradation.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature rating ensures the display controller remains operational even in cold environments, offering consistent performance across a wide range of temperatures.

Terminal Position: QUAD

Quad terminal position provides stable and secure connections, reducing the risk of signal interference or loss in communication, improving overall signal integrity and reliability.

Display Config: 1280 X 1024 PIXELS

Supporting high-resolution display configurations enables the display controller to deliver sharp and detailed visuals, making it suitable for applications where image clarity is crucial.

Maximum Seated Height: 4.07 mm

Low maximum seated height allows for a more compact design and efficient use of space in the overall system layout, enhancing flexibility in installation and integration.

Width: 27.64 mm

Compact width dimension enables the display controller to fit into tight spaces or densely populated circuit boards, facilitating streamlined and space-efficient product designs.

External Data Bus Width: 8

Having a wider external data bus width allows for faster data transfer rates and enhanced processing capabilities, leading to improved performance and responsiveness in handling data-intensive tasks.

Maximum Clock Frequency: 14.31818 MHz

High maximum clock frequency supports rapid data processing and efficient operation of the display controller, enabling smooth and responsive performance in handling tasks that require real-time data processing.

Length: 27.64 mm

Compact length dimension ensures the display controller can be easily integrated into space-constrained designs, enabling flexibility in product layout and accommodating various form factor requirements.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates that the display controller is suitable for standard commercial applications, ensuring compatibility and reliable performance in typical operating environments.

Peripheral IC Type: DISPLAY CONTROLLER, PALETTE DAC

Incorporating display controller and palette DAC functionality in a single peripheral IC simplifies system design and integration, reducing component count and overall system cost while providing enhanced display capabilities.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems, making the display controller energy-efficient, reliable, and versatile in various applications.

Terminal Form: GULL WING

Gull wing terminal form provides secure solder connections and easy assembly on circuit boards, ensuring reliable electrical connections and facilitating efficient manufacturing processes.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage of 5 V ensures consistent and reliable power input for the display controller, supporting optimal performance and preventing voltage-related issues that could affect system operation.

Terminal Pitch: 0.65 mm

Narrow terminal pitch of 0.65 mm enables high-density packaging and precise alignment of terminals, maximizing connectivity options and promoting efficient signal transmission in the display controller.

Technical Specifications

Display Controllers TVP3026-135AMDN attributes and parameters. Explore more Display Controllers devices from Texas Instruments

Specs

Address Bus Width:

4

Maximum Clock Frequency:

14.31818 MHz

Display Config:

1280 X 1024 PIXELS

External Data Bus Width:

8

JESD-30 Code:

S-MQFP-G160

Length:

27.64 mm

No. of Terminals:

160

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

METAL

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Maximum Seated Height:

4.07 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

27.64 mm

Peripheral IC Type:

Trade Compliance

TVP3026-135AMDN Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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