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TVP3010-170MGA

Texas Instruments

TVP3010-170MGA by Texas Instruments

TVP3010-170MGA by Texas Instruments is a display controller with 1600x1280 pixels, 8-bit data bus, and 170 MHz clock frequency. Ideal for military applications due to its MIL temperature grade and palette DAC peripheral IC type. Package style is grid array with 84 terminals in a square shape.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,390 parts In-Stock

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3,390

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Digiode

USA . 296 parts In-Stock

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296

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AZTECH Wire

Italy . 217 parts In-Stock

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$10.875

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217

$10.875

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One Stop Electronics

USA . 991 parts In-Stock

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$30.000

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991

$30.000

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Parana Technologies

USA . 1,176 parts In-Stock

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$42.637

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$42.637

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DigiPath Technology Company

USA . 878 parts In-Stock

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$46.949

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$43.193

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878

$46.949

$43.193

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ChromeModa Solutions

Germany . 1,295 parts In-Stock

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$47.907

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$39.284

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1,295

$47.907

$39.284

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IDEA Electronic Components Group

UK . 550 parts In-Stock

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$47.907

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$45.512

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$43.116

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550

$47.907

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$43.116

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Corohmni

South Africa . 1,156 parts In-Stock

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$77.614

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Corphita

USA . 2,942 parts In-Stock

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Overview

Elevate your display technology with the TVP3010-170MGA from Texas Instruments. Crafted with precision and quality, this display controller offers unparalleled performance and reliability, making it the ideal choice for a wide range of applications. Whether you're looking to enhance your digital signage, medical imaging systems, or industrial displays, this product delivers exceptional value with its advanced features and robust design. Trust in Texas Instruments to provide cutting-edge solutions that exceed expectations and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This package body material ensures durability and reliability, making the product suitable for harsh environmental conditions.

Maximum Supply Voltage: 5.25 V

The higher maximum supply voltage allows for flexibility in power input and ensures stable performance under varying voltage conditions.

Address Bus Width: 3

The wider address bus width enables efficient data handling and processing, improving overall performance.

Package Shape: SQUARE

The square package shape allows for efficient use of space and easy integration into different electronic systems.

No. of Terminals: 84

Having a higher number of terminals allows for more connectivity options and functionality, making the product versatile.

Package Style (Meter): GRID ARRAY

The grid array package style enables easy installation and connections, reducing the chances of errors during integration.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage ensures that the product can operate efficiently even with lower power input, saving energy.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand heat-intensive environments without compromising performance.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature allows the product to function reliably in cold conditions, making it suitable for a wide range of applications.

Terminal Position: PERPENDICULAR

The perpendicular terminal position facilitates easy connection and integration, ensuring smooth operation within electronic systems.

Display Config: 1600 X 1280 PIXELS

The high resolution display configuration provides crisp and clear visuals, enhancing the user experience.

Maximum Seated Height: 5.21 mm

The compact maximum seated height allows for slim and sleek design options, making the product suitable for space-constrained applications.

Width: 32 mm

The moderate width size provides a balance between compactness and functionality, allowing for easy integration into different devices.

External Data Bus Width: 8

The wider external data bus width enables faster data transfer and processing, enhancing overall system performance.

Maximum Clock Frequency: 170 MHz

With a high maximum clock frequency, the product can handle data at a rapid pace, ensuring smooth and responsive operation.

Length: 32 mm

The moderate length size provides a compact form factor, making the product suitable for various electronic applications.

Temperature Grade: MILITARY

The military-grade temperature rating ensures that the product can operate reliably in challenging environmental conditions, making it ideal for defense and aerospace applications.

Peripheral IC Type: DISPLAY CONTROLLER, PALETTE DAC

The inclusion of display controller and palette DAC peripherals enhances the product's functionality, allowing for advanced display capabilities and color management.

Technology: CMOS

The CMOS technology used in the product ensures low power consumption and high performance, making it energy-efficient and reliable.

Terminal Form: PIN/PEG

The PIN/PEG terminal form allows for easy installation and connection, ensuring a secure and stable interface within electronic systems.

Nominal Supply Voltage: 5 V

The stable nominal supply voltage ensures consistent and reliable operation, preventing voltage fluctuations that could affect performance.

Terminal Pitch: 2.54 mm

The standard terminal pitch enables easy connectivity with other components, ensuring compatibility and ease of integration.

Technical Specifications

Display Controllers TVP3010-170MGA attributes and parameters. Explore more Display Controllers devices from Texas Instruments

Specs

Address Bus Width:

3

Maximum Clock Frequency:

170 MHz

Display Config:

1600 X 1280 PIXELS

External Data Bus Width:

8

JESD-30 Code:

S-CPGA-P84

Length:

32 mm

No. of Terminals:

84

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

PGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

Maximum Seated Height:

5.21 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Width:

32 mm

Peripheral IC Type:

Trade Compliance

TVP3010-170MGA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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