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TVP3010-135MFN

Texas Instruments

TVP3010-135MFN by Texas Instruments

TVP3010-135MFN by Texas Instruments is a display controller with 1600x1280 pixels, 8-bit data bus, and 135 MHz clock frequency. Ideal for military applications due to its CMOS technology, operating temperature range of -55°C to 125°C, and quad terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,069 parts In-Stock

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Digiode

USA . 67 parts In-Stock

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67

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Distributors (Availability)

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AZTECH Wire

Italy . 472 parts In-Stock

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$13.923

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$13.923

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One Stop Electronics

USA . 1,177 parts In-Stock

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$15.000

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Parana Technologies

USA . 1,934 parts In-Stock

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$30.628

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$69.218

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$30.628

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DigiPath Technology Company

USA . 429 parts In-Stock

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$33.726

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$31.028

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429

$33.726

$31.028

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ChromeModa Solutions

Germany . 2,108 parts In-Stock

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$34.414

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$28.219

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$34.414

$28.219

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IDEA Electronic Components Group

UK . 1,588 parts In-Stock

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$34.414

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$32.693

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$30.973

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1,588

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$30.973

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Corohmni

South Africa . 112 parts In-Stock

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$35.326

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Corphita

USA . 2,628 parts In-Stock

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Overview

Enhance your display experience with the Texas Instruments TVP3010-135MFN Display Controller. Crafted with precision and reliability in mind, this product by a trusted manufacturer offers seamless integration and top-notch performance. Ideal for a wide range of applications, this chip carrier package comes with 84 terminals and a military-grade temperature grade, ensuring durability in even the most demanding environments. With a maximum clock frequency of 135 MHz and an external data bus width of 8, this display controller delivers unmatched value, benefits, and advantages to customers seeking quality and efficiency in their electronic displays. Elevate your visual displays with the TVP3010-135MFN today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Using plastic/epoxy as the package body material makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving time in manufacturing processes.

Maximum Supply Voltage: 5.25 V

Higher maximum supply voltage provides flexibility in power input options and ensures stable performance under varying voltage conditions.

Address Bus Width: 3

Wider address bus width allows for efficient data transfer and communication between components, enhancing overall performance and speed.

Package Shape: SQUARE

Square package shape helps in easy integration into circuit layouts, optimizing space utilization and ensuring a compact design.

No. of Terminals: 84

Having a higher number of terminals enables seamless connectivity with other components, enhancing functionality and versatility of the product.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers high protection against external elements and mechanical stresses, ensuring reliability and long-term durability.

Minimum Supply Voltage: 4.75 V

Lower minimum supply voltage allows for efficient power consumption and operation at lower power levels, ideal for energy-saving applications.

Maximum Operating Temperature: 125 °C

High maximum operating temperature range enables the product to withstand harsh environmental conditions and ensures consistent performance in extreme temperatures.

Minimum Operating Temperature: -55 °C

Wide minimum operating temperature range guarantees functionality even in freezing temperatures, making the product suitable for varied operating environments.

Terminal Position: QUAD

Quad terminal position allows for easy connection and secure placement on the circuit board, facilitating efficient installation and maintenance.

Display Config: 1600 X 1280 PIXELS

High display resolution of 1600 x 1280 pixels offers sharp and detailed image quality, enhancing visual experience and clarity of displayed content.

Maximum Seated Height: 4.57 mm

Low maximum seated height minimizes the overall profile of the product, enabling sleek and compact device designs.

Width: 29.3116 mm

Optimal width dimension ensures compatibility with standard PCB layouts and facilitates seamless integration into electronic systems.

External Data Bus Width: 8

Wider external data bus width allows for high-speed data transfer and processing, improving overall system performance and efficiency.

Maximum Clock Frequency: 135 MHz

High maximum clock frequency offers fast data processing capabilities, ensuring smooth operation and responsiveness in real-time applications.

Length: 29.3116 mm

Compact length dimension enables space-efficient PCB placement, contributing to streamlined circuit board designs.

Temperature Grade: MILITARY

Military-grade temperature rating guarantees ruggedness and reliability under extreme conditions, making the product suitable for demanding industrial and defense applications.

Peripheral IC Type: DISPLAY CONTROLLER, PALETTE DAC

Integration of display controller and palette DAC in the peripheral IC enhances display performance and color accuracy, providing excellent visual output.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption, high-speed operation, and enhanced reliability, making the product energy-efficient and durable.

Terminal Form: J BEND

J bend terminal form offers secure connection points and ease of soldering, ensuring reliable electrical contact and stable signal transmission.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage of 5V ensures consistent and reliable power delivery to the product, supporting optimal performance and functionality.

Terminal Pitch: 1.27 mm

Narrow terminal pitch of 1.27mm optimizes PCB layout space, enabling high-density mounting and precise connections for enhanced reliability.

Technical Specifications

Display Controllers TVP3010-135MFN attributes and parameters. Explore more Display Controllers devices from Texas Instruments

Specs

Address Bus Width:

3

Maximum Clock Frequency:

135 MHz

Display Config:

1600 X 1280 PIXELS

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J84

Length:

29.3116 mm

No. of Terminals:

84

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

29.3116 mm

Peripheral IC Type:

Trade Compliance

TVP3010-135MFN Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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