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TVP3010-110MFN

Texas Instruments

TVP3010-110MFN by Texas Instruments

TVP3010-110MFN by Texas Instruments is a display controller with 1600x1280 pixels, 8-bit data bus, and 110 MHz clock frequency. Ideal for military applications due to its CMOS technology, operating temperature range of -55°C to 125°C, and quad terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,100 parts In-Stock

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4,100

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Digiode

USA . 2,700 parts In-Stock

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2,700

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Distributors (Availability)

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AZTECH Wire

Italy . 218 parts In-Stock

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$4.943

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218

$4.943

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One Stop Electronics

USA . 1,063 parts In-Stock

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$10.000

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$10.000

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Parana Technologies

USA . 2,332 parts In-Stock

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$54.229

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2,332

$54.229

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DigiPath Technology Company

USA . 209 parts In-Stock

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$59.713

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$54.936

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209

$59.713

$54.936

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ChromeModa Solutions

Germany . 5,488 parts In-Stock

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$60.932

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$49.964

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5,488

$60.932

$49.964

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IDEA Electronic Components Group

UK . 1,744 parts In-Stock

1+ parts

$60.932

100+ parts

$57.885

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$54.839

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1,744

$60.932

$57.885

$54.839

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Corohmni

South Africa . 968 parts In-Stock

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$76.693

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Corphita

USA . 3,172 parts In-Stock

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3,172

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Overview

Elevate your display experience with the Texas Instruments TVP3010-110MFN, a top-of-the-line product in the realm of Display Controllers. Crafted with precision by renowned manufacturer Texas Instruments, this device offers unparalleled quality and reliability. From military-grade technology to a maximum clock frequency of 110 MHz, this chip carrier package is designed to exceed expectations. Whether you're working on high-resolution displays or intricate graphics, the TVP3010-110MFN delivers exceptional performance and value. Upgrade your projects today with this cutting-edge display controller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the display controller easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology makes the product versatile and easy to integrate into various electronic systems.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage provides flexibility in power requirements for the display controller.

Address Bus Width: 3

The wider address bus allows for efficient data transfer and processing, enhancing the performance of the display controller.

Package Shape: SQUARE

The square shape of the package ensures easy and secure mounting in electronic devices.

No. of Terminals: 84

The numerous terminals allow for multiple connections, enabling the display controller to interface with various components effectively.

Package Style (Meter): CHIP CARRIER

The chip carrier package style is compact and efficient, optimizing the space utilization in electronic designs.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage ensures compatibility with a wide range of power sources, making the display controller versatile.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows the display controller to withstand challenging environmental conditions.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature ensures the display controller functions reliably in cold environments.

Terminal Position: QUAD

The quad terminal position enables secure and stable connections for enhanced performance of the display controller.

Display Config: 1600 X 1280 PIXELS

The high-resolution display configuration delivers clear and detailed images, making the product suitable for advanced visual applications.

Maximum Seated Height: 4.57 mm

The low seated height allows the display controller to be efficiently mounted in compact electronic devices.

Width: 29.3116 mm

The compact width of the display controller facilitates easy integration into electronic designs with limited space.

External Data Bus Width: 8

The wider external data bus width enables faster data transfer rates, enhancing the overall performance of the display controller.

Maximum Clock Frequency: 110 MHz

The high clock frequency ensures fast processing speeds and smooth operation of the display controller.

Length: 29.3116 mm

The compact length of the product allows for space-efficient installation in electronic systems.

Temperature Grade: MILITARY

The military-grade temperature rating ensures the display controller can withstand harsh environmental conditions typical in military applications.

Peripheral IC Type: DISPLAY CONTROLLER, PALETTE DAC

The inclusion of a display controller and palette DAC enhances the functionality and versatility of the product for advanced display processing.

Technology: CMOS

The CMOS technology used in the display controller ensures low power consumption and high noise immunity, resulting in efficient performance.

Terminal Form: J BEND

The J bend terminal form provides secure and reliable connections for stable operation of the display controller.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V is commonly used in electronics, ensuring widespread compatibility of the display controller.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for high-density mounting of the display controller, maximizing space efficiency in electronic designs.

Technical Specifications

Display Controllers TVP3010-110MFN attributes and parameters. Explore more Display Controllers devices from Texas Instruments

Specs

Address Bus Width:

3

Maximum Clock Frequency:

110 MHz

Display Config:

1600 X 1280 PIXELS

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J84

Length:

29.3116 mm

No. of Terminals:

84

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

29.3116 mm

Peripheral IC Type:

Trade Compliance

TVP3010-110MFN Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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