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TVP3010-135CFN

Texas Instruments

TVP3010-135CFN by Texas Instruments

TVP3010-135CFN by Texas Instruments is a display controller with 1600x1280 pixels, 8-bit data bus, and 135 MHz clock frequency. It is used in commercial applications for driving high-resolution displays efficiently. The chip carrier package has 84 terminals and operates b/w 0 to 70°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,055 parts In-Stock

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8,055

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Digiode

USA . 1,781 parts In-Stock

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1,781

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Distributors (Availability)

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Semicontronic

India . 442 parts In-Stock

1+ parts

$4.000

100+ parts

$3.900

1k+ parts

$3.880

10k+ parts

-

442

$4.000

$3.900

$3.880

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AZTECH Wire

Italy . 578 parts In-Stock

1+ parts

$16.200

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578

$16.200

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One Stop Electronics

USA . 1,489 parts In-Stock

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$18.000

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1,489

$18.000

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Ampacity Inc.

Singapore . 1,282 parts In-Stock

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$19.000

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1,282

$19.000

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Parana Technologies

USA . 2,361 parts In-Stock

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$57.324

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2,361

$57.324

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Corohmni

South Africa . 860 parts In-Stock

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$60.092

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860

$60.092

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DigiPath Technology Company

USA . 1,648 parts In-Stock

1+ parts

$63.121

100+ parts

$58.071

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1,648

$63.121

$58.071

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ChromeModa Solutions

Germany . 2,724 parts In-Stock

1+ parts

$64.409

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$52.815

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2,724

$64.409

$52.815

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IDEA Electronic Components Group

UK . 1,576 parts In-Stock

1+ parts

$64.409

100+ parts

$61.189

1k+ parts

$57.968

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1,576

$64.409

$61.189

$57.968

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Corphita

USA . 2,621 parts In-Stock

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Overview

Enhance your display experience with the TVP3010-135CFN by Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments delivers top-quality display controllers that cater to a wide range of applications. This chip carrier package offers a seamless surface mount installation, providing easy integration for your projects. With a maximum clock frequency of 135 MHz and a display configuration of 1600 x 1280 pixels, this product ensures high performance and stunning visuals. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations and enhances your display solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and long-lasting.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of the product onto circuit boards.

Maximum Supply Voltage: 5.25 V

This higher voltage tolerance ensures the product can handle fluctuations in power without being damaged.

Address Bus Width: 3

A wider address bus allows for more memory addresses to be accessed, enabling higher resolution displays.

Package Shape: SQUARE

The square shape allows for easier mounting and placement within electronic devices.

No. of Terminals: 84

Having a high number of terminals enables seamless connectivity with other components in the system.

Package Style (Meter): CHIP CARRIER

Chip carrier packages offer good thermal and electrical performance, ensuring the product operates efficiently.

Minimum Supply Voltage: 4.75 V

A low minimum supply voltage ensures the product can function even in low power situations.

Maximum Operating Temperature: 70 °C

With a high operating temperature limit, the product can be used in a variety of environments without overheating.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures ensures the product is reliable in cold climates or during temperature fluctuations.

Terminal Position: QUAD

Quad terminal position offers stability and secure connections, reducing the risk of loose connections or malfunctions.

Display Config: 1600 X 1280 PIXELS

The high resolution display configuration provides sharp and detailed images for an enhanced user experience.

Maximum Seated Height: 4.57 mm

A low seated height allows for a compact design, making it suitable for space-constrained applications.

Width: 29.3116 mm

The moderate width of the product enables easy integration into different electronic devices.

External Data Bus Width: 8

A wider data bus allows for faster data transfer and processing, enhancing the overall performance of the product.

Maximum Clock Frequency: 135 MHz

A high clock frequency enables rapid data processing and refresh rates, resulting in smooth visuals on the display.

Length: 29.3116 mm

The moderate length of the product ensures compatibility with various device sizes and form factors.

Temperature Grade: COMMERCIAL

Suitable for use in commercial applications, ensuring reliability and performance in standard operating conditions.

Peripheral IC Type: DISPLAY CONTROLLER, PALETTE DAC

Integrated display controller and palette DAC provide advanced control over display settings and color outputs.

Technology: CMOS

CMOS technology offers energy efficiency and fast switching speeds, enhancing the overall performance of the product.

Terminal Form: J BEND

J bend terminals provide a secure connection and ease of installation, ensuring reliable performance.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V ensures compatibility with standard power sources, making the product versatile.

Terminal Pitch: 1.27 mm

The tight terminal pitch allows for efficient use of space on circuit boards, enabling compact and streamlined designs.

Technical Specifications

Display Controllers TVP3010-135CFN attributes and parameters. Explore more Display Controllers devices from Texas Instruments

Specs

Address Bus Width:

3

Maximum Clock Frequency:

135 MHz

Display Config:

1600 X 1280 PIXELS

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J84

Length:

29.3116 mm

No. of Terminals:

84

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

29.3116 mm

Peripheral IC Type:

Trade Compliance

TVP3010-135CFN Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.3

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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