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TVP3010-170MFN

Texas Instruments

TVP3010-170MFN by Texas Instruments

TVP3010-170MFN by Texas Instruments is a display controller with 1600x1280 pixels, 8-bit data bus, and 170 MHz clock frequency. Ideal for military applications due to its CMOS technology, operating temperature range of -55 to 125 °C, and quad terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,775 parts In-Stock

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6,775

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Digiode

USA . 1,254 parts In-Stock

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1,254

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Distributors (Availability)

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One Stop Electronics

USA . 1,633 parts In-Stock

1+ parts

$6.000

100+ parts

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1,633

$6.000

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AZTECH Wire

Italy . 430 parts In-Stock

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$13.291

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430

$13.291

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Parana Technologies

USA . 2,152 parts In-Stock

1+ parts

$30.510

100+ parts

$2,833.325

1k+ parts

$27.459

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2,152

$30.510

$2,833.325

$27.459

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DigiPath Technology Company

USA . 233 parts In-Stock

1+ parts

$33.595

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233

$33.595

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ChromeModa Solutions

Germany . 4,658 parts In-Stock

1+ parts

$34.281

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$28.110

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4,658

$34.281

$28.110

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IDEA Electronic Components Group

UK . 837 parts In-Stock

1+ parts

$34.281

100+ parts

$32.567

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$30.853

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837

$34.281

$32.567

$30.853

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Corohmni

South Africa . 1,179 parts In-Stock

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$76.607

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1,179

$76.607

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Corphita

USA . 902 parts In-Stock

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Overview

Enhance your display control with the TVP3010-170MFN from Texas Instruments. This high-quality display controller offers unparalleled performance and reliability, making it the ideal choice for a wide range of applications. With a maximum clock frequency of 170 MHz and a temperature grade of MILITARY, this product ensures seamless operation even in the most demanding environments. Trust in Texas Instruments' reputation for excellence and innovation, and experience the benefits of optimal display control with the TVP3010-170MFN.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the display controller easy to handle and long-lasting.

Surface Mount: YES

Surface mount capability allows for easy installation on circuit boards, saving time and effort in the manufacturing process.

Maximum Supply Voltage: 5.25 V

High maximum supply voltage tolerance ensures reliable operation and protection against voltage spikes.

Address Bus Width: 3

Wide address bus width allows for efficient communication between the display controller and other components in the system.

Package Shape: SQUARE

Square package shape makes the display controller easy to integrate into existing systems and provides a compact form factor.

Display Config: 1600 X 1280 PIXELS

High display resolution of 1600x1280 pixels ensures clear and detailed images on the screen, making it suitable for various applications.

Maximum Clock Frequency: 170 MHz

High maximum clock frequency allows for fast data processing and smooth operation of the display controller.

Technology: CMOS

CMOS technology ensures low power consumption and high performance, making the display controller energy-efficient and reliable.

Technical Specifications

Display Controllers TVP3010-170MFN attributes and parameters. Explore more Display Controllers devices from Texas Instruments

Specs

Address Bus Width:

3

Maximum Clock Frequency:

170 MHz

Display Config:

1600 X 1280 PIXELS

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J84

Length:

29.3116 mm

No. of Terminals:

84

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

29.3116 mm

Peripheral IC Type:

Trade Compliance

TVP3010-170MFN Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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