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LC74798

Onsemi

LC74798 by Onsemi

LC74798 by Onsemi is a Display Controller with 30 terminals, operating at temperatures from -30 to 70 °C. It features a 5V supply voltage and CMOS technology, making it ideal for graphics processing applications. The package is made of plastic/epoxy in an inline, shrink pitch style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,612 parts In-Stock

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Vyrian

USA . 540 parts In-Stock

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540

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

SupplyDigital Components

Austria . 7,816 parts In-Stock

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Kulean Microsystems

USA . 5,145 parts In-Stock

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Problanco Electronics

Mexico . 2,349 parts In-Stock

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Corphita

USA . 1,386 parts In-Stock

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TANS Electronics

Latvia . 709 parts In-Stock

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UHIMA Technologies

Türkiye . 451 parts In-Stock

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Corohmni

South Africa . 274 parts In-Stock

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Overview

Elevate your display experience with the LC74798 by Onsemi. As a leading manufacturer in display controllers, Onsemi delivers unmatched quality and reliability in every product. The LC74798 is designed to optimize visual performance, providing seamless integration and enhanced functionality for a wide range of applications. With its innovative technology and user-friendly design, this graphics processor promises to elevate your viewing experience like never before. Upgrade to the LC74798 today and unlock a world of possibilities for your display needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ideal for portable devices.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into various electronic devices.

Power Supplies (V): 5

Operating at 5V makes it compatible with common power sources, increasing versatility.

No. of Terminals: 30

Having 30 terminals allows for a wide range of connectivity options with other components.

Package Style (Meter): IN-LINE, SHRINK PITCH

The in-line and shrink pitch style saves space and simplifies circuit layout.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, it can withstand high-performance demands.

Minimum Operating Temperature: -30 °C

The minimum operating temperature of -30 °C ensures reliability in various environmental conditions.

Peripheral IC Type: GRAPHICS PROCESSOR

Incorporating a graphics processor enhances visual performance and capabilities.

Technology: CMOS

CMOS technology offers low power consumption, suitable for energy-efficient devices.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide easy assembly and stable connections.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V ensures consistent and reliable operation.

Terminal Pitch: 1.78 mm

The 1.78mm terminal pitch allows for precise connections and efficient signal transmission.

Technical Specifications

Display Controllers LC74798 attributes and parameters. Explore more Display Controllers devices from Onsemi

Specs

JESD-30 Code:

R-PDIP-T30

No. of Terminals:

30

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP30,.4

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Display Controllers

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.78 mm

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

LC74798 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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