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TLC34076-170MFN

Texas Instruments

TLC34076-170MFN by Texas Instruments

TLC34076-170MFN by Texas Instruments is a display controller with 8-bit external data bus width, operating at 170 MHz clock frequency. It has a temperature range of -55 to 125 °C and is suitable for military-grade applications requiring palette DAC functionality.

Median Price

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Lifecycle Status

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2

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1k+

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Vyrian

USA . 4,548 parts In-Stock

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Digiode

USA . 1,311 parts In-Stock

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AZTECH Wire

Italy . 342 parts In-Stock

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$16.678

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One Stop Electronics

USA . 1,476 parts In-Stock

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$31.000

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Parana Technologies

USA . 388 parts In-Stock

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$41.345

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DigiPath Technology Company

USA . 803 parts In-Stock

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$45.526

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$41.884

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ChromeModa Solutions

Germany . 737 parts In-Stock

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$46.455

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$38.093

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737

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IDEA Electronic Components Group

UK . 222 parts In-Stock

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$46.455

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$44.132

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$41.810

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Corohmni

South Africa . 2,092 parts In-Stock

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$70.576

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Corphita

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Overview

Unlock the power of advanced display control with the TLC34076-170MFN by Texas Instruments. Designed with precision and innovation, this chip carrier package offers unparalleled quality and reliability for your display controller needs. From military-grade applications to cutting-edge palette DAC technology, this versatile product provides maximum performance with a clock frequency of up to 170 MHz. Elevate your projects with the TLC34076-170MFN and experience the value and benefits that only Texas Instruments can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for portable electronic devices.

Surface Mount: YES

Being surface mountable allows for easy integration onto circuit boards, saving space and facilitating automated assembly processes.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage ensures compatibility with a wide range of power sources, increasing flexibility in system design.

Address Bus Width: 4

The 4-bit address bus width allows for efficient communication between components, enhancing the controller's performance.

Package Shape: SQUARE

The square package shape provides a compact footprint, optimizing board space utilization in crowded electronic assemblies.

No. of Terminals: 84

With a high number of terminals, this display controller can support a variety of input/output connections, enabling versatile functionality.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers robust protection for the controller's internal components, ensuring reliability in harsh operating conditions.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage allows the controller to operate efficiently even in low-power scenarios, extending its range of applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this controller can withstand elevated environmental conditions, suitable for industrial and automotive applications.

Minimum Operating Temperature: -55 °C

The wide operating temperature range enables the controller to function reliably in extreme cold environments, offering versatility in deployment.

Terminal Position: QUAD

The quad terminal position simplifies the connection process and enhances signal integrity, contributing to overall system stability.

Maximum Seated Height: 4.57 mm

The compact maximum seated height allows for a low-profile installation, advantageous for space-constrained device designs.

Width: 29.31 mm

The moderate width dimension facilitates integration into standard electronic layouts, ensuring compatibility with existing systems.

External Data Bus Width: 8

The 8-bit external data bus width enables high-speed data transfer within the controller, enhancing display performance and responsiveness.

Maximum Clock Frequency: 170 MHz

With a high maximum clock frequency, this controller can process data rapidly, supporting smooth display operation and real-time updates.

Length: 29.31 mm

The matching length dimension complements the controller's width, providing a balanced form factor for streamlined circuit board layout.

Temperature Grade: MILITARY

The military-grade temperature rating signifies robustness and reliability, making this controller suitable for demanding military and aerospace applications.

Peripheral IC Type: DISPLAY CONTROLLER, PALETTE DAC

The inclusion of a display controller and palette DAC as peripheral IC types enhances the controller's versatility in managing display output and color reproduction.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high noise immunity, making the controller energy-efficient and reliable in noisy environments.

Terminal Form: J BEND

The J bend terminal form simplifies soldering and improves mechanical stability, enhancing the durability of the controller during installation and usage.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage is a common standard in electronics, ensuring compatibility with a wide range of power sources and reducing design complexities.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for high-density mounting of the controller on a PCB, maximizing space efficiency and enabling compact device designs.

Technical Specifications

Display Controllers TLC34076-170MFN attributes and parameters. Explore more Display Controllers devices from Texas Instruments

Specs

Address Bus Width:

4

Maximum Clock Frequency:

170 MHz

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J84

Length:

29.31 mm

No. of Terminals:

84

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

29.31 mm

Peripheral IC Type:

Trade Compliance

TLC34076-170MFN Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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