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TLC34074-135FNR

Texas Instruments

TLC34074-135FNR by Texas Instruments

TLC34074-135FNR by Texas Instruments is a display controller with 8-bit external data bus, 135 MHz clock frequency, and 4 address bus width. It is used in applications requiring palette DAC technology for commercial temperature grade displays.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,270 parts In-Stock

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3,270

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Vyrian

USA . 1,987 parts In-Stock

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1,987

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Distributors (Availability)

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One Stop Electronics

USA . 515 parts In-Stock

1+ parts

$3.000

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515

$3.000

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AZTECH Wire

Italy . 528 parts In-Stock

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$13.944

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528

$13.944

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Parana Technologies

USA . 1,909 parts In-Stock

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$14.587

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$15.024

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1,909

$14.587

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$15.024

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DigiPath Technology Company

USA . 1,582 parts In-Stock

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$16.062

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1,582

$16.062

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IDEA Electronic Components Group

UK . 1,128 parts In-Stock

1+ parts

$16.390

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$15.570

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$14.751

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1,128

$16.390

$15.570

$14.751

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ChromeModa Solutions

Germany . 1,008 parts In-Stock

1+ parts

$16.390

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$13.440

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1,008

$16.390

$13.440

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Corohmni

South Africa . 2,227 parts In-Stock

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$17.672

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Corphita

USA . 950 parts In-Stock

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Overview

Experience unmatched quality and reliability with the TLC34074-135FNR from Texas Instruments, a leading manufacturer in the industry. As a display controller, this versatile product offers a wide range of applications with its innovative technology. Enhance your projects with ease using this high-performance chip carrier package that ensures seamless operation. With a maximum clock frequency of 135 MHz and commercial temperature grade, the TLC34074-135FNR delivers exceptional value and benefits to customers looking for superior display control solutions. Trust Texas Instruments for top-notch quality and performance every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material is lightweight and durable, making the product suitable for portable devices.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and cost during production.

Address Bus Width: 4

A 4-bit address bus width allows for efficient data transfer and processing, enhancing the performance of the display controller.

Package Shape: SQUARE

The square package shape provides a compact and space-saving design, ideal for applications where size is a concern.

No. of Terminals: 44

With 44 terminals, the display controller can accommodate multiple connections and peripherals, expanding its functionality.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers improved thermal performance and better heat dissipation, ensuring reliable operation in various environments.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the display controller can withstand high temperatures and operate efficiently even in challenging conditions.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures reliable performance in cold environments, making the product suitable for a wide range of applications.

Terminal Position: QUAD

The quad terminal position provides a secure and stable connection, reducing the risk of signal interference or data loss.

Maximum Seated Height: 4.57 mm

The maximum seated height of 4.57 mm allows for easy integration into compact devices or systems with limited space.

Width: 16.5862 mm

The width of 16.5862 mm offers a slim and sleek profile, making the display controller suitable for thin and stylish gadgets.

External Data Bus Width: 8

An 8-bit external data bus width enables faster data transmission and processing, enhancing the overall performance of the display controller.

Maximum Clock Frequency: 135 MHz

The maximum clock frequency of 135 MHz ensures smooth and efficient operation, making the product suitable for high-speed applications.

Length: 16.5862 mm

The length of 16.5862 mm offers a compact and space-efficient design, ideal for devices where size is critical.

Temperature Grade: COMMERCIAL

Designed for commercial applications, the display controller meets industry standards and requirements for reliable performance in various commercial settings.

Peripheral IC Type: DISPLAY CONTROLLER, PALETTE DAC

The display controller with palette DAC ensures accurate color representation and high-quality display output, making it suitable for multimedia and graphics-intensive applications.

Technology: CMOS

The CMOS technology offers low power consumption and high reliability, resulting in energy-efficient and durable performance of the display controller.

Terminal Form: J BEND

The J bend terminal form provides a secure and stable connection, reducing the risk of signal loss or damage during use.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27 mm, the display controller allows for precise and reliable connections, ensuring consistent performance in various applications.

Technical Specifications

Display Controllers TLC34074-135FNR attributes and parameters. Explore more Display Controllers devices from Texas Instruments

Specs

Address Bus Width:

4

Maximum Clock Frequency:

135 MHz

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J44

Length:

16.5862 mm

No. of Terminals:

44

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

16.5862 mm

Peripheral IC Type:

Trade Compliance

TLC34074-135FNR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.3

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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