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COP472WM-3/63

Texas Instruments

COP472WM-3/63 by Texas Instruments

COP472WM-3/63 by Texas Instruments is a Display Controller with 20 terminals, operating at 0-70°C. It supports power supplies of 3.3/5V and has a max supply current of 0.25mA. Ideal for applications requiring MOS technology and small outline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,736 parts In-Stock

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Digiode

USA . 1,549 parts In-Stock

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1,549

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Northwest PG Solutions

USA . 2,304 parts In-Stock

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$2.904

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2,304

$2.904

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AZTECH Wire

Italy . 300 parts In-Stock

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$14.615

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300

$14.615

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Corohmni

South Africa . 872 parts In-Stock

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$17.703

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872

$17.703

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One Stop Electronics

USA . 477 parts In-Stock

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$22.000

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477

$22.000

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Parana Technologies

USA . 2,217 parts In-Stock

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$63.466

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2,217

$63.466

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DigiPath Technology Company

USA . 2,330 parts In-Stock

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$69.884

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$64.293

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$69.884

$64.293

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IDEA Electronic Components Group

UK . 489 parts In-Stock

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$71.310

100+ parts

$67.744

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$64.179

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489

$71.310

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$64.179

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ChromeModa Solutions

Germany . 79 parts In-Stock

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$71.310

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$58.474

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79

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$58.474

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Corphita

USA . 1,189 parts In-Stock

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Native Components

USA . 746 parts In-Stock

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$2.561

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Microchip USA

USA . 429 parts In-Stock

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Overview

Discover the cutting-edge technology of the COP472WM-3/63 by Texas Instruments, a top-of-the-line display controller perfect for a wide range of applications. With a reputation for excellence, Texas Instruments delivers unparalleled quality and reliability in every product. This compact device offers customers exceptional value, providing seamless integration and high performance. Say goodbye to technical headaches and hello to effortless operation with the COP472WM-3/63. Upgrade your display system today with this innovative solution!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package lightweight and durable, ideal for portable devices.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards.

Package Shape: RECTANGULAR

Rectangular shape provides a standardized form factor for easy integration into various electronic designs.

Power Supplies (V): 3.3/5

Supports multiple voltage power supplies for flexible compatibility with different systems.

No. of Terminals: 20

Having 20 terminals allows for versatile connectivity options for various components.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the circuit board, making it suitable for compact designs.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures reliable performance even under demanding conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows for usage in a wide range of environments.

Terminal Position: DUAL

Dual terminal position provides redundancy and improves signal integrity.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates suitability for standard commercial applications.

Technology: MOS

MOS technology offers low power consumption and high speed operation.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and connection during assembly.

Maximum Supply Current: 0.25 mA

Low maximum supply current helps in reducing power consumption and improving efficiency.

Terminal Pitch: 1.27 mm

Narrow terminal pitch allows for compact design and efficient use of board space.

Technical Specifications

Display Controllers COP472WM-3/63 attributes and parameters. Explore more Display Controllers devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G20

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3.3/5

Sub-Category:

Display Controllers

Maximum Supply Current:

.25 mA

Surface Mount:

YES

Technology:

MOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

COP472WM-3/63 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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