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TVP3026-250AMDN

Texas Instruments

TVP3026-250AMDN by Texas Instruments

TVP3026-250AMDN by Texas Instruments is a Display Controller with 1280x1024 pixels, 8-bit data bus, and 14.31818 MHz clock frequency. It is used in commercial applications for driving displays with a resolution of up to 1280x1024 pixels at temperatures ranging from 0°C to 70°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,013 parts In-Stock

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Digiode

USA . 3,187 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 1,634 parts In-Stock

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$6.000

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1,634

$6.000

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AZTECH Wire

Italy . 397 parts In-Stock

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$17.975

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397

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Parana Technologies

USA . 1,459 parts In-Stock

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$43.104

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$43.104

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DigiPath Technology Company

USA . 120 parts In-Stock

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$47.463

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120

$47.463

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ChromeModa Solutions

Germany . 3,482 parts In-Stock

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$48.432

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$39.714

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3,482

$48.432

$39.714

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IDEA Electronic Components Group

UK . 1,190 parts In-Stock

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$48.432

100+ parts

$46.010

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$43.589

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1,190

$48.432

$46.010

$43.589

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Corohmni

South Africa . 940 parts In-Stock

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$67.446

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940

$67.446

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Corphita

USA . 1,916 parts In-Stock

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Overview

Elevate your display experience with the TVP3026-250AMDN by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality display controllers that provide seamless integration and exceptional performance. This versatile product is perfect for a wide range of applications, offering customers unmatched value and benefits. Upgrade your visual displays with ease and precision, thanks to the advanced technology and reliable design of the TVP3026-250AMDN.

Feature Benefit Bullets

Package Body Material: METAL

Metal package body provides durability and better heat dissipation, making the product more reliable and long-lasting.

Surface Mount: YES

Surface mount feature makes the installation of the display controller easier and more convenient.

Maximum Supply Voltage: 5.25 V

Allows for a higher supply voltage which can improve performance and stability of the display controller.

Address Bus Width: 4

A wider address bus width allows for efficient and smooth communication between components in the system.

Package Shape: SQUARE

Square package shape helps in easy integration and space-saving in the design of electronic devices.

No. of Terminals: 160

A higher number of terminals provide more connectivity options for different interfaces and peripherals.

Package Style (Meter): FLATPACK

Flatpack package style ensures a slim profile and efficient use of space in electronic devices.

Minimum Supply Voltage: 4.75 V

Having a minimum supply voltage of 4.75 V ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the display controller can function reliably in various environments.

Minimum Operating Temperature: 0 °C

The ability to operate at temperatures as low as 0°C ensures the display controller's performance in cold conditions.

Terminal Position: QUAD

Quad terminal position enables easy connectivity and integration into the electronic circuit.

Display Config: 1280 X 1024 PIXELS

Supports high display resolution of 1280 x 1024 pixels, ensuring clear and sharp visual output.

Maximum Seated Height: 4.07 mm

Low seated height of 4.07 mm allows for a compact design and efficient use of space in electronic devices.

Width: 27.64 mm

The width of 27.64 mm provides a balance between compactness and ease of installation in electronic systems.

External Data Bus Width: 8

Having an external data bus width of 8 allows for faster data transfer and processing within the display controller.

Maximum Clock Frequency: 14.31818 MHz

High maximum clock frequency of 14.31818 MHz enables efficient processing and operation of the display controller.

Length: 27.64 mm

The length of 27.64 mm complements the width and provides a balanced form factor for easy integration.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures the display controller's reliability and performance in standard operating conditions.

Peripheral IC Type: DISPLAY CONTROLLER, PALETTE DAC

Includes both display controller and palette DAC, providing comprehensive control and customization options for the display output.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and reliability in the operation of the display controller.

Terminal Form: GULL WING

Gull wing terminal form enhances solder joint strength, making connections more robust and durable.

Nominal Supply Voltage: 5 V

Nominal supply voltage of 5 V ensures stable and consistent power delivery to the display controller for reliable operation.

Terminal Pitch: 0.65 mm

Having a terminal pitch of 0.65 mm allows for precise and secure connections in the electronic circuit.

Technical Specifications

Display Controllers TVP3026-250AMDN attributes and parameters. Explore more Display Controllers devices from Texas Instruments

Specs

Address Bus Width:

4

Maximum Clock Frequency:

14.31818 MHz

Display Config:

1280 X 1024 PIXELS

External Data Bus Width:

8

JESD-30 Code:

S-MQFP-G160

Length:

27.64 mm

No. of Terminals:

160

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

METAL

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Maximum Seated Height:

4.07 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

27.64 mm

Peripheral IC Type:

Trade Compliance

TVP3026-250AMDN Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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