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TVP3010-110MGA

Texas Instruments

TVP3010-110MGA by Texas Instruments

TVP3010-110MGA by Texas Instruments is a display controller with 1600x1280 pixels, 8-bit data bus, and 110 MHz clock frequency. Ideal for military applications due to its MIL temperature grade and CMOS technology. Package style: grid array, terminal pitch: 2.54mm, and operates b/w -55°C to 125°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,009 parts In-Stock

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3,009

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Digiode

USA . 1,396 parts In-Stock

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1,396

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Distributors (Availability)

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AZTECH Wire

Italy . 565 parts In-Stock

1+ parts

$8.842

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565

$8.842

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One Stop Electronics

USA . 1,520 parts In-Stock

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$10.000

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1,520

$10.000

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Corohmni

South Africa . 793 parts In-Stock

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$20.392

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793

$20.392

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Parana Technologies

USA . 1,374 parts In-Stock

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$65.791

100+ parts

$6,109.653

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$59.212

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1,374

$65.791

$6,109.653

$59.212

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DigiPath Technology Company

USA . 682 parts In-Stock

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$72.444

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682

$72.444

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ChromeModa Solutions

Germany . 2,291 parts In-Stock

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$73.922

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$60.616

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2,291

$73.922

$60.616

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IDEA Electronic Components Group

UK . 65 parts In-Stock

1+ parts

$73.922

100+ parts

$70.226

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$66.530

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65

$73.922

$70.226

$66.530

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Corphita

USA . 722 parts In-Stock

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Overview

Discover the cutting-edge TVP3010-110MGA from Texas Instruments, a leading manufacturer known for top-quality display controllers. This versatile product is ideal for a wide range of applications, offering customers unparalleled value and benefits. With its advanced technology and military-grade temperature grade, the TVP3010-110MGA provides crystal-clear display configurations at a maximum clock frequency of 110 MHz. Elevate your projects with this powerful and reliable solution that sets the standard for excellence in the industry.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

Provides durability and reliability ensuring the product can withstand harsh environments.

Maximum Supply Voltage: 5.25 V

Allows for a wider operating voltage range, increasing compatibility with various power sources.

Address Bus Width: 3

Efficiently handles address information, enabling the controller to communicate effectively with the display.

Package Shape: SQUARE

Offers a compact form factor, optimizing space utilization in electronic devices.

No. of Terminals: 84

Sufficient number of terminals for connecting various components, enhancing versatility in integration.

Maximum Operating Temperature: 125 °C

Can operate reliably at high temperatures, crucial for industrial and demanding environments.

Minimum Operating Temperature: -55 °C

Capable of functioning in extremely low temperatures, suitable for outdoor applications or cold storage environments.

Display Config: 1600 X 1280 PIXELS

Supports high-resolution displays, delivering sharp and detailed visuals for enhanced user experience.

Maximum Clock Frequency: 110 MHz

Enables fast data processing, leading to smooth and responsive display performance.

Temperature Grade: MILITARY

Meets stringent military standards for reliability and durability, ensuring optimal performance in demanding conditions.

Technology: CMOS

Utilizes efficient CMOS technology for low power consumption and high speed operation.

Nominal Supply Voltage: 5 V

Compatible with standard voltage levels, making integration into existing systems easier.

Technical Specifications

Display Controllers TVP3010-110MGA attributes and parameters. Explore more Display Controllers devices from Texas Instruments

Specs

Address Bus Width:

3

Maximum Clock Frequency:

110 MHz

Display Config:

1600 X 1280 PIXELS

External Data Bus Width:

8

JESD-30 Code:

S-CPGA-P84

Length:

32 mm

No. of Terminals:

84

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

PGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

Maximum Seated Height:

5.21 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Width:

32 mm

Peripheral IC Type:

Trade Compliance

TVP3010-110MGA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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