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TVP3010-135CGA

Texas Instruments

TVP3010-135CGA by Texas Instruments

TVP3010-135CGA by Texas Instruments is a display controller with 1600x1280 pixels, 8-bit data bus, and 135 MHz clock frequency. It operates b/w 0-70°C, ideal for commercial applications requiring high-resolution displays in a compact 32mm square package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,745 parts In-Stock

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3,745

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Digiode

USA . 3,331 parts In-Stock

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3,331

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Distributors (Availability)

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AZTECH Wire

Italy . 312 parts In-Stock

1+ parts

$12.694

100+ parts

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312

$12.694

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Parana Technologies

USA . 1,617 parts In-Stock

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$16.211

100+ parts

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$16.525

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1,617

$16.211

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$16.525

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ChromeModa Solutions

Germany . 5,942 parts In-Stock

1+ parts

$18.215

100+ parts

$14.936

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5,942

$18.215

$14.936

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IDEA Electronic Components Group

UK . 477 parts In-Stock

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$18.215

100+ parts

$17.304

1k+ parts

$16.394

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477

$18.215

$17.304

$16.394

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One Stop Electronics

USA . 724 parts In-Stock

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$25.000

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724

$25.000

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Corohmni

South Africa . 4,928 parts In-Stock

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$32.672

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4,928

$32.672

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DigiPath Technology Company

USA . 1,412 parts In-Stock

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$16.423

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1,412

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$16.423

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Corphita

USA . 398 parts In-Stock

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398

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Overview

Enhance your display technology with the TVP3010-135CGA by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-notch quality and reliability in their products. This display controller offers seamless integration and high performance, making it ideal for a wide range of applications. From digital signage to medical imaging, this product provides value, benefits, and advantages that cater to all your display needs. Upgrade your visual experience with the TVP3010-135CGA today!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired package body materials provide durability and protection against environmental factors, making this product reliable and long-lasting.

Maximum Supply Voltage: 5.25 V

The higher maximum supply voltage allows for better flexibility in power requirements, accommodating a wider range of power sources.

Address Bus Width: 3

The 3-bit address bus width enables efficient communication between components, improving data transfer speed and performance.

Package Shape: SQUARE

The square package shape allows for easy integration into electronic devices and optimal use of space, making it a practical choice for compact designs.

No. of Terminals: 84

With 84 terminals, this display controller can support a variety of input and output connections, enhancing compatibility and functionality.

Minimum Supply Voltage: 4.75 V

The lower minimum supply voltage ensures efficient power consumption and compatibility with a range of power sources, helping to optimize energy usage.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature tolerance of 70°C ensures reliable performance even in harsh conditions, making it suitable for a wide range of applications.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C allows this display controller to function in cold environments without compromising performance.

Terminal Position: PERPENDICULAR

The perpendicular terminal position facilitates easy connections and installation, improving overall usability and convenience.

Display Config: 1600 X 1280 PIXELS

The high resolution display configuration of 1600 x 1280 pixels delivers sharp and detailed images, enhancing the visual quality of the output.

Maximum Seated Height: 5.21 mm

The low maximum seated height of 5.21 mm allows for a compact design and efficient use of space, making this product suitable for slim electronic devices.

Width: 32 mm

The 32 mm width provides a good balance between compact size and adequate space for components, offering versatility in design options.

External Data Bus Width: 8

The 8-bit external data bus width allows for efficient data transfer and processing, improving performance and responsiveness of the display controller.

Maximum Clock Frequency: 135 MHz

The high maximum clock frequency of 135 MHz ensures rapid data processing and smooth operation, making this display controller suitable for high-speed applications.

Length: 32 mm

The 32 mm length complements the width and seated height, providing a compact form factor that is ideal for integration into various electronic devices.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures reliable performance in standard operating conditions, making this display controller suitable for a wide range of commercial applications.

Peripheral IC Type: DISPLAY CONTROLLER, PALETTE DAC

The inclusion of display controller and palette DAC peripherals enhances the functionality and versatility of this product, making it a comprehensive solution for display management.

Technology: CMOS

The CMOS technology used in this display controller offers low power consumption, high noise immunity, and compatibility with a wide range of electronic devices.

Terminal Form: PIN/PEG

The pin/peg terminal form provides secure and reliable connections, ensuring stable performance and ease of installation in electronic systems.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V is a standard requirement in many electronic devices, ensuring compatibility and seamless integration with existing systems.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch allows for easy connections and compatibility with standard connectors, facilitating installation and maintenance of the display controller.

Technical Specifications

Display Controllers TVP3010-135CGA attributes and parameters. Explore more Display Controllers devices from Texas Instruments

Specs

Address Bus Width:

3

Maximum Clock Frequency:

135 MHz

Display Config:

1600 X 1280 PIXELS

External Data Bus Width:

8

JESD-30 Code:

S-CPGA-P84

Length:

32 mm

No. of Terminals:

84

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

PGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

Maximum Seated Height:

5.21 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Width:

32 mm

Peripheral IC Type:

Trade Compliance

TVP3010-135CGA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.3

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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