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TVP3010-170CFN

Texas Instruments

TVP3010-170CFN by Texas Instruments

TVP3010-170CFN by Texas Instruments is a display controller with 1600x1280 pixels, 8-bit data bus, and 170 MHz clock frequency. It is used in commercial applications for driving high-resolution displays efficiently. The chip carrier package style makes it suitable for surface mount assembly with a max supply voltage of 5.25V.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,298 parts In-Stock

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4,298

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Digiode

USA . 681 parts In-Stock

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681

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Distributors (Availability)

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One Stop Electronics

USA . 1,487 parts In-Stock

1+ parts

$3.000

100+ parts

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1,487

$3.000

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AZTECH Wire

Italy . 1,250 parts In-Stock

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$10.421

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$10.421

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Corohmni

South Africa . 332 parts In-Stock

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$18.226

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332

$18.226

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Parana Technologies

USA . 893 parts In-Stock

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$54.106

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893

$54.106

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DigiPath Technology Company

USA . 358 parts In-Stock

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$59.577

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358

$59.577

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ChromeModa Solutions

Germany . 1,913 parts In-Stock

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$60.793

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$49.850

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1,913

$60.793

$49.850

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IDEA Electronic Components Group

UK . 1,229 parts In-Stock

1+ parts

$60.793

100+ parts

$57.753

1k+ parts

$54.714

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1,229

$60.793

$57.753

$54.714

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Corphita

USA . 4,915 parts In-Stock

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4,915

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Overview

Enhance your display experience with the TVP3010-170CFN by Texas Instruments. Designed with precision and reliability in mind, this display controller offers exceptional performance and versatility for a wide range of applications. Whether you're looking to upgrade your gaming console or streamline your digital signage, the TVP3010-170CFN provides unmatched value and benefits. Trust in Texas Instruments' reputation for quality and innovation, and elevate your display solutions today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and lightweight design.

Surface Mount: YES

Allows for easy installation and integration into electronic devices.

Maximum Supply Voltage: 5.25 V

Provides a stable power supply for optimal performance.

Address Bus Width: 3

Efficiently handles data transfers and communication within the device.

Package Shape: SQUARE

A compact and uniform shape that facilitates assembly and placement in devices.

No. of Terminals: 84

Sufficient terminals for connectivity and functionality.

Package Style (Meter): CHIP CARRIER

Ensures secure packaging and protection of the display controller.

Minimum Supply Voltage: 4.75 V

Allows for operation at lower power levels while maintaining performance.

Maximum Operating Temperature: 70 °C

Can withstand high temperatures without affecting functionality.

Minimum Operating Temperature: 0 °C

Suitable for operation in various environmental conditions.

Terminal Position: QUAD

Facilitates easier connection and installation within devices.

Display Config: 1600 X 1280 PIXELS

High-resolution display capability for sharp and clear visuals.

Maximum Seated Height: 4.57 mm

Low profile design for space-saving installation.

Width: 29.3116 mm

Compact size for easy integration into electronic devices.

External Data Bus Width: 8

Efficient data transfer rate for smooth operation.

Maximum Clock Frequency: 170 MHz

High clock frequency for fast processing of data and commands.

Length: 29.3116 mm

Compact and uniform size for easy installation.

Temperature Grade: COMMERCIAL

Suitable for commercial applications and environments.

Peripheral IC Type: DISPLAY CONTROLLER, PALETTE DAC

Includes additional features for enhanced display control and color accuracy.

Technology: CMOS

Utilizes CMOS technology for efficient power consumption and performance.

Terminal Form: J BEND

Specific terminal form for secure and stable connections.

Nominal Supply Voltage: 5 V

Stable supply voltage for reliable performance.

Terminal Pitch: 1.27 mm

Optimal terminal pitch for connectivity and signal transmission.

Technical Specifications

Display Controllers TVP3010-170CFN attributes and parameters. Explore more Display Controllers devices from Texas Instruments

Specs

Address Bus Width:

3

Maximum Clock Frequency:

170 MHz

Display Config:

1600 X 1280 PIXELS

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J84

Length:

29.3116 mm

No. of Terminals:

84

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

29.3116 mm

Peripheral IC Type:

Trade Compliance

TVP3010-170CFN Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.3

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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