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TVP3010-110CFN

Texas Instruments

TVP3010-110CFN by Texas Instruments

TVP3010-110CFN by Texas Instruments is a display controller with 1600x1280 pixels, 8-bit data bus, and 110 MHz clock frequency. It is used in commercial applications for driving high-resolution displays efficiently. The chip carrier package has 84 terminals and operates b/w 0 to 70°C temperature range.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,251 parts In-Stock

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5,251

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Digiode

USA . 590 parts In-Stock

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590

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Distributors (Availability)

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AZTECH Wire

Italy . 312 parts In-Stock

1+ parts

$6.202

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312

$6.202

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One Stop Electronics

USA . 710 parts In-Stock

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$28.000

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710

$28.000

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Corohmni

South Africa . 652 parts In-Stock

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$50.324

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652

$50.324

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Parana Technologies

USA . 1,126 parts In-Stock

1+ parts

$72.976

100+ parts

$6,776.969

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$65.679

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1,126

$72.976

$6,776.969

$65.679

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DigiPath Technology Company

USA . 221 parts In-Stock

1+ parts

$80.356

100+ parts

$73.928

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221

$80.356

$73.928

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ChromeModa Solutions

Germany . 2,386 parts In-Stock

1+ parts

$81.996

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$67.237

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2,386

$81.996

$67.237

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IDEA Electronic Components Group

UK . 664 parts In-Stock

1+ parts

$81.996

100+ parts

$77.896

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$73.796

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664

$81.996

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$73.796

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Corphita

USA . 4,133 parts In-Stock

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Overview

Enhance your display experience with the TVP3010-110CFN by Texas Instruments. As a leading manufacturer in display controllers, Texas Instruments delivers top-notch quality and reliability in all their products. The TVP3010-110CFN is perfect for various applications, offering customers incredible value, benefits, and advantages. Upgrade your display with this innovative product and enjoy superior performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product less prone to damage during handling and installation.

Surface Mount: YES

Surface mount technology allows for easy and efficient mounting on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 5.25 V

Higher supply voltage allows for better overall performance and stability of the display controller.

Address Bus Width: 3

A wider address bus width allows for faster communication and processing of data within the display controller.

Package Shape: SQUARE

Square package shape ensures easy and secure placement on the PCB, optimizing space utilization.

No. of Terminals: 84

Higher number of terminals provide more connectivity options and flexibility in interfacing with other components.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers a compact form factor, ideal for space-constrained applications.

Minimum Supply Voltage: 4.75 V

Having a minimum supply voltage of 4.75 V ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures reliable performance even in demanding environmental conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature guarantees functionality in a variety of temperature settings.

Terminal Position: QUAD

Quad terminal position enables secure and stable connection on the PCB, minimizing the risk of loose connections.

Display Config: 1600 X 1280 PIXELS

High display resolution of 1600x1280 pixels ensures sharp and detailed images on the screen.

Maximum Seated Height: 4.57 mm

Low seated height of 4.57 mm allows for a slim design and easy integration into compact devices.

Width: 29.3116 mm

Compact width of 29.3116 mm facilitates easy placement in tight spaces and improves overall PCB layout.

External Data Bus Width: 8

Wider external data bus width of 8 allows for faster data transfer and better performance of the display controller.

Maximum Clock Frequency: 110 MHz

High maximum clock frequency of 110 MHz enables quick processing and smooth operation of the display controller.

Length: 29.3116 mm

Compact length of 29.3116 mm ensures a space-saving design and ease of placement on the PCB.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures compatibility with standard operating conditions in most commercial applications.

Peripheral IC Type: DISPLAY CONTROLLER, PALETTE DAC

Incorporation of display controller and palette DAC in the peripheral IC type enhances color accuracy and control of the display output.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and reliability, making it an ideal choice for display controllers.

Terminal Form: J BEND

J bend terminal form provides secure connection and ensures stability during operation, reducing the risk of signal interference.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage of 5 V ensures consistent and reliable performance of the display controller.

Terminal Pitch: 1.27 mm

Standard terminal pitch of 1.27 mm allows for easy and accurate soldering on the PCB, simplifying the assembly process.

Technical Specifications

Display Controllers TVP3010-110CFN attributes and parameters. Explore more Display Controllers devices from Texas Instruments

Specs

Address Bus Width:

3

Maximum Clock Frequency:

110 MHz

Display Config:

1600 X 1280 PIXELS

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J84

Length:

29.3116 mm

No. of Terminals:

84

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

29.3116 mm

Peripheral IC Type:

Trade Compliance

TVP3010-110CFN Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.3

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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