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TVP3026-250BMDN

Texas Instruments

TVP3026-250BMDN by Texas Instruments

TVP3026-250BMDN by Texas Instruments is a Display Controller with 1280x1024 resolution, 8-bit data bus, and 14.31818 MHz clock frequency. Ideal for commercial applications requiring high-quality display control in a compact square flatpack package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,753 parts In-Stock

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5,753

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Digiode

USA . 2,524 parts In-Stock

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2,524

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Distributors (Availability)

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AZTECH Wire

Italy . 871 parts In-Stock

1+ parts

$6.030

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871

$6.030

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Parana Technologies

USA . 1,539 parts In-Stock

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$21.829

100+ parts

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$22.313

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1,539

$21.829

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$22.313

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ChromeModa Solutions

Germany . 2,061 parts In-Stock

1+ parts

$24.527

100+ parts

$20.112

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2,061

$24.527

$20.112

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IDEA Electronic Components Group

UK . 791 parts In-Stock

1+ parts

$24.527

100+ parts

$23.301

1k+ parts

$22.074

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791

$24.527

$23.301

$22.074

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One Stop Electronics

USA . 1,235 parts In-Stock

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$34.000

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1,235

$34.000

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Corohmni

South Africa . 250 parts In-Stock

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$63.535

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250

$63.535

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Corphita

USA . 4,955 parts In-Stock

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DigiPath Technology Company

USA . 1,836 parts In-Stock

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$22.114

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1,836

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Overview

Elevate your display experience with the TVP3026-250BMDN by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality products like this display controller that offer unparalleled performance and reliability. Perfect for a wide range of applications, this product provides customers with seamless integration, enhanced visual quality, and efficient operation. Invest in excellence with the TVP3026-250BMDN and unlock a world of possibilities for your display needs.

Feature Benefit Bullets

Package Body Material: METAL

The use of metal as the package body material provides durability and heat dissipation, making the product long-lasting and reliable.

Surface Mount: YES

Surface mount capability allows for easy integration into circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 5.25 V

Operating within a wide range of supply voltages allows for flexibility in different electronic systems.

Address Bus Width: 4

A wider address bus width allows for handling larger amounts of data efficiently, enhancing performance.

Package Shape: SQUARE

A square package shape offers a compact design, ideal for space-constrained applications.

No. of Terminals: 160

Having a high number of terminals provides ample connectivity options and versatility in communication.

Package Style (Meter): FLATPACK

The flatpack package style offers ease of mounting and securing on a circuit board.

Minimum Supply Voltage: 4.75 V

The ability to operate at low supply voltages ensures energy efficiency and compatibility with various power sources.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, the product can withstand challenging environmental conditions without compromising performance.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures makes the product suitable for a wide range of applications, including industrial and automotive.

Terminal Position: QUAD

Quad terminal positioning allows for secure connections and efficient signal transmission.

Display Config: 1280 X 1024 PIXELS

Support for high-resolution display configurations ensures sharp and detailed visuals for the end-user.

Maximum Seated Height: 4.07 mm

The low maximum seated height contributes to a slim and space-saving design for the overall system.

Width: 27.64 mm

A moderate width size offers a good balance between space efficiency and ease of integration in electronic devices.

External Data Bus Width: 8

An external data bus width of 8 allows for high-speed data transfer and communication, enhancing overall system performance.

Maximum Clock Frequency: 14.31818 MHz

Support for a high clock frequency allows for faster processing and response times, making the product suitable for real-time applications.

Length: 27.64 mm

A matching length to the width provides a compact and uniform form factor, aiding in the overall design aesthetics.

Temperature Grade: COMMERCIAL

Designed for commercial-grade applications, ensuring reliability and performance in typical operating environments.

Peripheral IC Type: DISPLAY CONTROLLER, PALETTE DAC

The inclusion of a display controller and palette DAC enhances color accuracy and control, resulting in vibrant and accurate on-screen visuals.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form provides secure soldering connections and ease of assembly onto circuit boards.

Nominal Supply Voltage: 5 V

Having a nominal supply voltage of 5V ensures compatibility with standard power sources and simplifies system integration.

Terminal Pitch: 0.65 mm

A fine terminal pitch of 0.65mm allows for high-density mounting and compact PCB layouts, saving space and enabling miniaturization.

Technical Specifications

Display Controllers TVP3026-250BMDN attributes and parameters. Explore more Display Controllers devices from Texas Instruments

Specs

Address Bus Width:

4

Maximum Clock Frequency:

14.31818 MHz

Display Config:

1280 X 1024 PIXELS

External Data Bus Width:

8

JESD-30 Code:

S-MQFP-G160

Length:

27.64 mm

No. of Terminals:

160

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

METAL

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Maximum Seated Height:

4.07 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

27.64 mm

Peripheral IC Type:

Trade Compliance

TVP3026-250BMDN Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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