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LC74763M

Onsemi

LC74763M by Onsemi

LC74763M by Onsemi is a display controller with 30 terminals, operating b/w -30 °C to 70°C. It has a supply voltage of 5V and uses CMOS technology. Ideal for graphics processing applications due to its small outline package and surface-mount capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

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Digiode

USA . 707 parts In-Stock

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Vyrian

USA . 210 parts In-Stock

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210

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Distributors (Availability)

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Kulean Microsystems

USA . 5,433 parts In-Stock

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5,433

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Problanco Electronics

Mexico . 4,393 parts In-Stock

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SupplyDigital Components

Austria . 4,261 parts In-Stock

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GreenTree Electronics

Israel . 1,430 parts In-Stock

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Corphita

USA . 1,383 parts In-Stock

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TANS Electronics

Latvia . 1,113 parts In-Stock

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UHIMA Technologies

Türkiye . 347 parts In-Stock

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347

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Perfect Parts

USA . 130 parts In-Stock

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Corohmni

South Africa . 108 parts In-Stock

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Overview

Unlock the power of cutting-edge display technology with the LC74763M by Onsemi. As a leader in the industry, Onsemi delivers exceptional quality and reliability, making them a trusted choice for manufacturers worldwide. The LC74763M is perfect for a wide range of applications, offering seamless graphics processing and superior performance. Experience the value and benefits this product brings to your projects, from enhanced visuals to improved efficiency. Upgrade your displays with the LC74763M and elevate your user experience to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body ensures durability and reliability in various operating conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving time and labor costs.

Package Shape: RECTANGULAR

Rectangular package shape enables efficient utilization of space on PCBs, optimizing overall design layout.

Power Supplies (V): 5

Operating at a standard voltage of 5V makes the display controller compatible with a wide range of electronic devices and systems.

No. of Terminals: 30

Having 30 terminals provides flexibility in connectivity options and supports the interface requirements of complex display systems.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch package style offers space-saving benefits and facilitates high-density mounting on PCBs.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, the display controller can reliably function in various environmental conditions without overheating.

Minimum Operating Temperature: -30 °C

The ability to operate at a minimum temperature of -30 °C ensures the display controller's functionality in cold environments.

Terminal Position: DUAL

Dual terminal position enhances connection stability and ensures secure and reliable electrical contacts.

Peripheral IC Type: GRAPHICS PROCESSOR

The incorporation of a graphics processor as the peripheral IC type enables advanced image processing capabilities and enhances display performance.

Technology: CMOS

Utilizing CMOS technology provides low power consumption, high integration capabilities, and compatibility with modern electronic systems.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering onto PCBs, ensuring strong and reliable electrical connections.

Nominal Supply Voltage: 5 V

Operates at a standard nominal supply voltage of 5V, ensuring compatibility with common power sources and simplifying integration into electronic systems.

Terminal Pitch: 1 mm

The 1mm terminal pitch offers fine pitch options for connectivity, allowing for compact design layouts and high connection densities.

Technical Specifications

Display Controllers LC74763M attributes and parameters. Explore more Display Controllers devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G30

No. of Terminals:

30

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP30,.4,40

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Display Controllers

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

LC74763M Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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