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LC74731W

Onsemi

LC74731W by Onsemi

The Onsemi LC74731W is a display controller with 64 terminals, operating b/w -30 °C to 70°C. It features a 5V supply voltage and CMOS technology, suitable for graphics processing applications. The package is a square-shaped flatpack made of plastic/epoxy, with surface mount capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

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Vyrian

USA . 342 parts In-Stock

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342

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Digiode

USA . 170 parts In-Stock

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170

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SupplyDigital Components

Austria . 5,928 parts In-Stock

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5,928

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Problanco Electronics

Mexico . 5,253 parts In-Stock

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TANS Electronics

Latvia . 4,892 parts In-Stock

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Corphita

USA . 1,559 parts In-Stock

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Kulean Microsystems

USA . 1,338 parts In-Stock

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UHIMA Technologies

Türkiye . 746 parts In-Stock

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746

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Corohmni

South Africa . 453 parts In-Stock

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Overview

Enhance your display experience with the LC74731W by Onsemi, a top-quality display controller that offers unrivaled performance and reliability. Manufactured by Onsemi, a trusted leader in the industry, this product boasts a wide range of applications in various electronic devices. With its advanced technology and innovative design, the LC74731W delivers exceptional value, benefits, and advantages to customers seeking seamless and efficient display control solutions. Upgrade your electronics with the LC74731W and enjoy a superior viewing experience like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability to the product.

Surface Mount: YES

Surface mount feature allows for easy and efficient installation on circuit boards.

Package Shape: SQUARE

Square shape makes it easier to place and secure the display controller in various devices.

Power Supplies (V): 5

Operating at 5V makes it compatible with a wide range of devices and power sources.

No. of Terminals: 64

Having 64 terminals allows for a greater range of connections and functionalities.

Package Style (Meter): FLATPACK

Flatpack package style makes the product compact and suitable for space-constrained applications.

Maximum Operating Temperature: 70 °C

Operating at a maximum temperature of 70 °C ensures stable performance under varying conditions.

Minimum Operating Temperature: -30 °C

Operating at a minimum temperature of -30 °C allows for use in a wide range of environments.

Terminal Position: QUAD

Quad terminal position provides flexibility in connections and integration with other components.

Peripheral IC Type: GRAPHICS PROCESSOR

Having a graphics processor integrated as a peripheral IC enhances display quality and performance.

Technology: CMOS

CMOS technology offers low power consumption and high integration, making the product efficient and cost-effective.

Terminal Form: GULL WING

Gull wing terminal form allows for easy soldering and secure connections on the circuit board.

Nominal Supply Voltage: 5 V

Operating at the nominal supply voltage of 5V ensures compatibility with standard power sources.

Terminal Pitch: 0.5 mm

Having a terminal pitch of 0.5mm allows for compact and precise connections on the circuit board.

Technical Specifications

Display Controllers LC74731W attributes and parameters. Explore more Display Controllers devices from Onsemi

Specs

JESD-30 Code:

S-PQFP-G64

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Display Controllers

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Peripheral IC Type:

Trade Compliance

LC74731W Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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