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LC74711

Onsemi

LC74711 by Onsemi

LC74711 by Onsemi is a display controller with 22 terminals, operating at temperatures from -30 to 70 °C. It has a supply voltage of 5V and uses CMOS technology. This graphics processor IC in rectangular plastic package is ideal for various display applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,978 parts In-Stock

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Vyrian

USA . 1,192 parts In-Stock

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1,192

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Distributors (Availability)

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Kulean Microsystems

USA . 4,635 parts In-Stock

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4,635

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SupplyDigital Components

Austria . 4,378 parts In-Stock

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4,378

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TANS Electronics

Latvia . 3,843 parts In-Stock

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3,843

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Problanco Electronics

Mexico . 2,471 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Kepictronics

USA . 510 parts In-Stock

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510

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UHIMA Technologies

Türkiye . 273 parts In-Stock

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Corohmni

South Africa . 231 parts In-Stock

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Corphita

USA . 160 parts In-Stock

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160

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Overview

Enhance your display experience with the LC74711 by Onsemi! Crafted with precision and expertise, this cutting-edge Display Controller is designed to elevate your visuals to new heights. Whether you're a creative professional looking for crisp graphics or a gamer seeking immersive gameplay, this product delivers unmatched performance and reliability. With a focus on quality and innovation, Onsemi ensures that every aspect of the LC74711 is optimized for maximum efficiency and user satisfaction. Upgrade your display technology today and discover the difference with Onsemi's LC74711.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and lightweight design, making the product easy to handle and transport.

Power Supplies (V): 5

Operates on a standard 5V power supply, making it compatible with a wide range of devices and power sources.

No. of Terminals: 22

With 22 terminals, this display controller offers multiple connection options for versatile installations and configurations.

Maximum Operating Temperature: 70 °C

Capable of operating efficiently in temperatures up to 70 °C, ensuring reliable performance in various environments.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high speed operation, making it energy-efficient and responsive.

Technical Specifications

Display Controllers LC74711 attributes and parameters. Explore more Display Controllers devices from Onsemi

Specs

JESD-30 Code:

R-PDIP-T22

No. of Terminals:

22

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP22,.3

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Display Controllers

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.78 mm

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

LC74711 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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