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TLC34076-85CFN

Texas Instruments

TLC34076-85CFN by Texas Instruments

TLC34076-85CFN by Texas Instruments is a Display Controller with 84 terminals, 8-bit data bus width, and 85 MHz clock frequency. It operates b/w 0 to 70°C and is suitable for commercial applications requiring palette DAC technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,048 parts In-Stock

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Digiode

USA . 3,211 parts In-Stock

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3,211

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Distributors (Availability)

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AZTECH Wire

Italy . 347 parts In-Stock

1+ parts

$17.621

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347

$17.621

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Parana Technologies

USA . 542 parts In-Stock

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$20.993

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$21.217

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542

$20.993

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$21.217

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ChromeModa Solutions

Germany . 4,130 parts In-Stock

1+ parts

$23.588

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$19.342

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4,130

$23.588

$19.342

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IDEA Electronic Components Group

UK . 763 parts In-Stock

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$23.588

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$22.409

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$21.229

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763

$23.588

$22.409

$21.229

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One Stop Electronics

USA . 1,433 parts In-Stock

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$34.000

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$34.000

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Corohmni

South Africa . 5,075 parts In-Stock

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$56.225

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$56.225

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DigiPath Technology Company

USA . 1,184 parts In-Stock

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$21.267

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$21.267

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Corphita

USA . 461 parts In-Stock

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Overview

Enhance your display applications with the TLC34076-85CFN by Texas Instruments. As a trusted manufacturer, Texas Instruments delivers top-quality products in the Display Controllers category. This chip carrier package offers a wide range of benefits, including a maximum clock frequency of 85 MHz and a commercial temperature grade. With a nominal supply voltage of 5V and a compact size, this display controller is perfect for various projects. Elevate your designs with the TLC34076-85CFN and experience the value and reliability that Texas Instruments is known for.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the display controller.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 5.25 V

Ability to handle high supply voltage levels ensures reliability and stability in operation.

Address Bus Width: 4

A wider address bus width allows for efficient communication and control of connected devices within the display system.

Package Shape: SQUARE

Square package shape enables compact and uniform placement of the display controller on a circuit board, optimizing space usage.

No. of Terminals: 84

Higher number of terminals provide more connectivity options and flexibility for interfacing with other components in the system.

Minimum Supply Voltage: 4.75 V

Wide range of supply voltage tolerance ensures compatibility with various power sources and environments.

Maximum Operating Temperature: 70 °C

High maximum operating temperature allows for reliable performance even in elevated temperature conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures functionality in cold environments.

Terminal Position: QUAD

Quad terminal position enhances stability and secure connection on the circuit board.

Maximum Seated Height: 4.57 mm

Low seated height enables a sleek and compact design for the overall display system.

Width: 29.31 mm

Optimal width dimension for easy integration and compatibility with standard board layouts.

External Data Bus Width: 8

Increased external data bus width allows for faster data transfer and improved performance of the display controller.

Maximum Clock Frequency: 85 MHz

High clock frequency capability supports fast processing and response times for smooth operation of the display controller.

Length: 29.31 mm

Balanced length dimension for efficient use of space on the circuit board while maintaining connectivity with other components.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable performance in standard operating conditions typically encountered in commercial applications.

Peripheral IC Type: DISPLAY CONTROLLER, PALETTE DAC

Inclusion of display controller and palette DAC peripherals enhances the functionality and versatility of the product for diverse display requirements.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and compatibility with various digital systems, making the display controller energy-efficient and reliable.

Terminal Form: J BEND

J bend terminal form ensures secure mounting and soldering on the circuit board, enhancing reliability and durability of the connection.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage ensures consistent and efficient operation of the display controller.

Terminal Pitch: 1.27 mm

Optimal terminal pitch allows for easy and precise connection with other components on the circuit board, facilitating smooth integration and assembly.

Technical Specifications

Display Controllers TLC34076-85CFN attributes and parameters. Explore more Display Controllers devices from Texas Instruments

Specs

Address Bus Width:

4

Maximum Clock Frequency:

85 MHz

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J84

Length:

29.31 mm

No. of Terminals:

84

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

29.31 mm

Peripheral IC Type:

Trade Compliance

TLC34076-85CFN Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.3

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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