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TLC34058-125FN

Texas Instruments

TLC34058-125FN by Texas Instruments

TLC34058-125FN by Texas Instruments is a display controller with 1280x1024 pixels, 125 MHz clock frequency, and 8-bit external data bus width. It is used in commercial applications for driving high-resolution displays efficiently.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,621 parts In-Stock

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Digiode

USA . 2,444 parts In-Stock

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2,444

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Distributors (Availability)

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One Stop Electronics

USA . 569 parts In-Stock

1+ parts

$11.000

100+ parts

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569

$11.000

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AZTECH Wire

Italy . 542 parts In-Stock

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$15.635

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542

$15.635

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Parana Technologies

USA . 1,701 parts In-Stock

1+ parts

$47.697

100+ parts

$4,429.379

1k+ parts

$42.927

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1,701

$47.697

$4,429.379

$42.927

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DigiPath Technology Company

USA . 1,312 parts In-Stock

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$52.520

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1,312

$52.520

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IDEA Electronic Components Group

UK . 1,649 parts In-Stock

1+ parts

$53.592

100+ parts

$50.912

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$48.233

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1,649

$53.592

$50.912

$48.233

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ChromeModa Solutions

Germany . 1,048 parts In-Stock

1+ parts

$53.592

100+ parts

$43.945

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1,048

$53.592

$43.945

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Corohmni

South Africa . 2,471 parts In-Stock

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$65.161

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Corphita

USA . 2,506 parts In-Stock

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2,506

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Overview

Elevate your display controller game with the TLC34058-125FN by Texas Instruments. This top-quality product is designed to deliver seamless performance and reliability, thanks to its cutting-edge technology and superior manufacturing standards. Perfect for a wide range of applications, this chip carrier package offers customers unbeatable value and benefits. Say goodbye to display issues and hello to crystal-clear visuals with this state-of-the-art solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving design in electronic devices.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage ensures stable operation and flexibility in power supply options.

Address Bus Width: 2

The address bus width of 2 allows for efficient communication and data transfer within the display controller.

Package Shape: SQUARE

The square package shape offers a compact design for easy integration into electronic devices.

No. of Terminals: 84

Having 84 terminals provides ample connectivity options and flexibility for interfacing with other components.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers a secure and reliable mounting option for the display controller.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage ensures energy efficiency and reliable operation at lower power levels.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the display controller can withstand higher temperature environments.

Minimum Operating Temperature: 0 °C

The ability to operate at temperatures as low as 0°C makes the product suitable for a wide range of environments.

Terminal Position: QUAD

The quad terminal position offers stability and ease of connection in electronic circuitry.

Display Config: 1280 X 1024 PIXELS

With a display configuration of 1280 x 1024 pixels, the display controller can support high-resolution graphics and images.

Maximum Seated Height: 4.57 mm

The low maximum seated height allows for compact device design and efficient use of space.

Width: 29.3116 mm

The compact width dimension enables easy integration and installation of the display controller in electronic devices.

External Data Bus Width: 8

An external data bus width of 8 ensures high-speed data transfer and efficient communication between components.

Maximum Clock Frequency: 125 MHz

With a maximum clock frequency of 125 MHz, the display controller can process data at high speeds for smooth performance.

Length: 29.3116 mm

The moderate length dimension facilitates easy placement and connection of the display controller within electronic devices.

Temperature Grade: COMMERCIAL

Being commercially graded, the display controller meets industry standards for reliability and performance.

Peripheral IC Type: DISPLAY CONTROLLER, PALETTE DAC

Featuring display controller and palette DAC peripherals, the product supports advanced display functionalities and color management.

Technology: CMOS

Utilizing CMOS technology, the display controller offers low power consumption and high noise immunity for efficient operation.

Terminal Form: J BEND

The J bend terminal form provides secure connections and ease of soldering for reliable circuitry.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V ensures compatibility with standard power sources for easy integration.

Bus Compatibility: TMS340XX

Designed for bus compatibility with TMS340XX series, ensuring seamless integration and communication with compatible devices.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27 mm offers precise alignment and spacing for efficient connectivity in electronic assemblies.

Technical Specifications

Display Controllers TLC34058-125FN attributes and parameters. Explore more Display Controllers devices from Texas Instruments

Specs

Address Bus Width:

2

Bus Compatibility:

TMS340XX

Maximum Clock Frequency:

125 MHz

Display Config:

1280 X 1024 PIXELS

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J84

Length:

29.3116 mm

No. of Terminals:

84

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

29.3116 mm

Peripheral IC Type:

Trade Compliance

TLC34058-125FN Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.3

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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