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TLC34058-110FNR

Texas Instruments

TLC34058-110FNR by Texas Instruments

TLC34058-110FNR by Texas Instruments is a Display Controller with 1280x1024 pixels, 110 MHz clock frequency, and 8-bit external data bus width. It is used in commercial applications for driving displays efficiently at temperatures ranging from 0 to 70°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 7,881 parts In-Stock

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Electronic Expediters

USA . 1,000 parts In-Stock

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Prism Electronics

USA . 400 parts In-Stock

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400

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Digiode

USA . 240 parts In-Stock

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240

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AZTECH Wire

Italy . 865 parts In-Stock

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$7.734

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$7.734

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One Stop Electronics

USA . 496 parts In-Stock

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$14.000

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Corohmni

South Africa . 60 parts In-Stock

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$24.451

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$24.451

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Parana Technologies

USA . 2,049 parts In-Stock

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$25.539

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$26.157

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2,049

$25.539

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ChromeModa Solutions

Germany . 5,635 parts In-Stock

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$28.696

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$23.531

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IDEA Electronic Components Group

UK . 1,566 parts In-Stock

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$28.696

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$27.261

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$25.826

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$25.826

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DigiPath Technology Company

USA . 2,313 parts In-Stock

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$25.872

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Corphita

USA . 1,440 parts In-Stock

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Perfect Parts

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Overview

Unleash the power of cutting-edge technology with the TLC34058-110FNR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Display Controllers that guarantee optimal performance and reliability. Perfect for a wide range of applications, this chip carrier package boasts a maximum clock frequency of 110 MHz and a display configuration of 1280 x 1024 pixels, providing customers with unparalleled value and benefits. Upgrade your display systems today with the TLC34058-110FNR and experience the difference that Texas Instruments can make in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and cost-effective, making the product reliable and affordable.

Surface Mount: YES

Surface mount technology allows for easy and efficient soldering onto circuit boards, increasing production efficiency.

Maximum Supply Voltage: 5.25 V

Higher maximum supply voltage provides flexibility in power input options while ensuring stable performance.

Address Bus Width: 2

Having a wider address bus width allows for efficient data transmission and processing, enhancing overall performance.

Package Shape: SQUARE

Square package shape is space-efficient and facilitates easy integration into electronic devices.

No. of Terminals: 84

Having a sufficient number of terminals enables connectivity with other components, ensuring seamless operation.

Package Style (Meter): CHIP CARRIER

Chip carrier package style is compact and protects the internal components, making the product suitable for compact devices.

Minimum Supply Voltage: 4.75 V

Lower minimum supply voltage ensures compatibility with a range of power sources and enhances energy efficiency.

Maximum Operating Temperature: 70 °C

High maximum operating temperature tolerance allows for reliable performance in various environmental conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures the product can function in cold environments without issues.

Terminal Position: QUAD

Quad terminal position allows for secure and stable connections, reducing the risk of loose connections or signal interruptions.

Display Config: 1280 X 1024 PIXELS

High display resolution of 1280 x 1024 pixels provides sharp and clear visuals, ideal for high-quality display applications.

Maximum Seated Height: 4.57 mm

Low maximum seated height enables the product to be used in slim and compact devices without compromising performance.

Width: 29.31 mm

Compact width dimensions make the product suitable for integration into devices with limited space availability.

External Data Bus Width: 8

Wider external data bus width allows for faster data transfer and processing, improving overall system efficiency.

Maximum Clock Frequency: 110 MHz

High maximum clock frequency enables speedy data processing and display refresh rates, enhancing user experience.

Length: 29.31 mm

Optimal length dimensions make the product versatile for integration into various electronic devices.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures the product meets standard operating temperature requirements for commercial applications.

Peripheral IC Type: DISPLAY CONTROLLER, PALETTE DAC

Having a display controller and palette DAC as peripheral IC types enhances display performance, color accuracy, and control options.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and reliable performance, making the product energy-efficient and durable.

Terminal Form: J BEND

J bend terminal form enhances connectivity and soldering stability, ensuring reliable and secure connections.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage of 5 V ensures consistent and reliable power input for optimal product performance.

Terminal Pitch: 1.27 mm

Fine terminal pitch of 1.27 mm allows for compact and precise assembly, reducing the risk of short circuits and signal interference.

Technical Specifications

Display Controllers TLC34058-110FNR attributes and parameters. Explore more Display Controllers devices from Texas Instruments

Specs

Address Bus Width:

2

Maximum Clock Frequency:

110 MHz

Display Config:

1280 X 1024 PIXELS

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J84

Length:

29.31 mm

No. of Terminals:

84

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

29.31 mm

Peripheral IC Type:

Trade Compliance

TLC34058-110FNR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.3

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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